Corporate-feed slotted wavguide array antenna at 350 GHz band by silicon process

Karim Tekkouk, Jiro Hirokawa, Kazuki Oogimoto, Tadao Nagatsuma, Hiroyuki Seto, Yoshiyuki Inoue, Mikiko Saito

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

A corporate feed slotted waveguide array antenna with broadband characteristics in term of gain in the 350 GHz band is achieved by measurement for the first time. The etching accuracy for thin laminated plates of the diffusion bonding process with conventional chemical etching is limited to ±20μm. This limits the use of this process for antenna fabrication in the submillimeter wave band where the fabrication tolerances are very severe. To improve the etching accuracy of the thin laminated plates, a new fabrication process has been developed. Each silicon wafer is etched by DRIE (deep reactive ion etcher) and is plated by gold on the surface. This new fabrication process provides better fabrication tolerances about ±5μ™ using wafer bond aligner. The thin laminated wafers are then bonded with the diffusion bonding process under high temperature and high pressure. To validate the proposed antenna concepts, four antenna prototypes have been designed and fabricated in the 350 GHz band. The 3dB-down gain bandwidth is about 35GHz by this silicon process while it was about 15GHz by the conventional process using metal plates in measurement.

Original languageEnglish
Title of host publication2016 IEEE Antennas and Propagation Society International Symposium, APSURSI 2016 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1197-1198
Number of pages2
ISBN (Electronic)9781509028863
DOIs
Publication statusPublished - 2016 Oct 25
Event2016 IEEE Antennas and Propagation Society International Symposium, APSURSI 2016 - Fajardo, Puerto Rico
Duration: 2016 Jun 262016 Jul 1

Other

Other2016 IEEE Antennas and Propagation Society International Symposium, APSURSI 2016
CountryPuerto Rico
CityFajardo
Period16/6/2616/7/1

Keywords

  • corporate feed waveguide
  • Diffusion bonding process
  • DRIE (deep reactive ion etcher)
  • Silicon process
  • slotted waveguide array
  • Submillimeter wave antennas

ASJC Scopus subject areas

  • Instrumentation
  • Radiation
  • Computer Networks and Communications

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  • Cite this

    Tekkouk, K., Hirokawa, J., Oogimoto, K., Nagatsuma, T., Seto, H., Inoue, Y., & Saito, M. (2016). Corporate-feed slotted wavguide array antenna at 350 GHz band by silicon process. In 2016 IEEE Antennas and Propagation Society International Symposium, APSURSI 2016 - Proceedings (pp. 1197-1198). [7696306] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APS.2016.7696306