Correlation between mechanical and dielectric relaxation processes in epoxy resin composites with nano- and micro-fillers

Mayumi Hyuga, Toshikatsu Tanaka, Yoshimichi Ohki, Takahiro Imai, Miyuki Harada, Mitsukazu Ochi

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Abstract

Effects of addition of nano-sized and micro-sized fillers into epoxy resin on its mechanical and dielectric relaxation phenomena were examined. The glass transition temperature (T g) decreased when a small content of nanoclay modified by octadecylamine was added, but the decrease in T g was suppressed when the nanoclay was modified by dimethyldodecylamine. On the other hand, T g increased when an abundant amount of microsilica was added. At temperatures above T g, both mechanical and dielectric relaxations were accelerated in samples with octadecylamine-modified nanoclay, while the acceleration did not occur in samples with nanoclay modified by dimethyldodecylamine. Both relaxations were restricted in composites with abundant microsilica. Therefore, co-addition of dimethyldodecylamine-modified nanoclay and abundant microsilica is adequate in order to make an epoxy resin composite with a high T g and low dielectric loss. ©2012 Wiley Periodicals, Inc. Electron Comm Jpn, 95(9): 1-9, 2012; Published online in Wiley Online Library (wileyonlinelibrary.com). DOI 10.1002/ecj.11420

Original languageEnglish
Pages (from-to)1-9
Number of pages9
JournalElectronics and Communications in Japan
Volume95
Issue number9
DOIs
Publication statusPublished - 2012 Sep 1

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Keywords

  • dielectric properties
  • epoxy resin
  • filler modifier.
  • mechanical properties
  • microcomposite
  • polymer nanocomposite

ASJC Scopus subject areas

  • Signal Processing
  • Physics and Astronomy(all)
  • Computer Networks and Communications
  • Electrical and Electronic Engineering
  • Applied Mathematics

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