Correlation between mechanical and dielectric relaxation processes in epoxy resin composites with nano- and micro-fillers

Mayumi Hyuga, Toshikatsu Tanaka, Yoshimichi Ohki, Takahiro Imai, Miyuki Harada, Mitsukazu Ochi

    Research output: Contribution to journalArticle

    1 Citation (Scopus)

    Abstract

    Effects of addition of nano-sized and micro-sized fillers into epoxy resin on its mechanical and dielectric relaxation phenomena were examined. The glass transition temperature (T g) decreased when a small content of nanoclay modified by octadecylamine was added, but the decrease in T g was suppressed when the nanoclay was modified by dimethyldodecylamine. On the other hand, T g increased when an abundant amount of microsilica was added. At temperatures above T g, both mechanical and dielectric relaxations were accelerated in samples with octadecylamine-modified nanoclay, while the acceleration did not occur in samples with nanoclay modified by dimethyldodecylamine. Both relaxations were restricted in composites with abundant microsilica. Therefore, co-addition of dimethyldodecylamine-modified nanoclay and abundant microsilica is adequate in order to make an epoxy resin composite with a high T g and low dielectric loss. ©2012 Wiley Periodicals, Inc. Electron Comm Jpn, 95(9): 1-9, 2012; Published online in Wiley Online Library (wileyonlinelibrary.com). DOI 10.1002/ecj.11420

    Original languageEnglish
    Pages (from-to)1-9
    Number of pages9
    JournalElectronics and Communications in Japan
    Volume95
    Issue number9
    DOIs
    Publication statusPublished - 2012 Sep

    Fingerprint

    Anelastic relaxation
    Dielectric Relaxation
    Epoxy Resin
    Silica fume
    Dielectric relaxation
    epoxy resins
    Relaxation processes
    fillers
    Epoxy resins
    Fillers
    Composite
    composite materials
    Glass Transition
    Composite materials
    Electron
    Dielectric losses
    dielectric loss
    Decrease
    glass transition temperature
    Electrons

    Keywords

    • dielectric properties
    • epoxy resin
    • filler modifier.
    • mechanical properties
    • microcomposite
    • polymer nanocomposite

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Computer Networks and Communications
    • Physics and Astronomy(all)
    • Signal Processing
    • Applied Mathematics

    Cite this

    Correlation between mechanical and dielectric relaxation processes in epoxy resin composites with nano- and micro-fillers. / Hyuga, Mayumi; Tanaka, Toshikatsu; Ohki, Yoshimichi; Imai, Takahiro; Harada, Miyuki; Ochi, Mitsukazu.

    In: Electronics and Communications in Japan, Vol. 95, No. 9, 09.2012, p. 1-9.

    Research output: Contribution to journalArticle

    Hyuga, Mayumi ; Tanaka, Toshikatsu ; Ohki, Yoshimichi ; Imai, Takahiro ; Harada, Miyuki ; Ochi, Mitsukazu. / Correlation between mechanical and dielectric relaxation processes in epoxy resin composites with nano- and micro-fillers. In: Electronics and Communications in Japan. 2012 ; Vol. 95, No. 9. pp. 1-9.
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    abstract = "Effects of addition of nano-sized and micro-sized fillers into epoxy resin on its mechanical and dielectric relaxation phenomena were examined. The glass transition temperature (T g) decreased when a small content of nanoclay modified by octadecylamine was added, but the decrease in T g was suppressed when the nanoclay was modified by dimethyldodecylamine. On the other hand, T g increased when an abundant amount of microsilica was added. At temperatures above T g, both mechanical and dielectric relaxations were accelerated in samples with octadecylamine-modified nanoclay, while the acceleration did not occur in samples with nanoclay modified by dimethyldodecylamine. Both relaxations were restricted in composites with abundant microsilica. Therefore, co-addition of dimethyldodecylamine-modified nanoclay and abundant microsilica is adequate in order to make an epoxy resin composite with a high T g and low dielectric loss. {\circledC}2012 Wiley Periodicals, Inc. Electron Comm Jpn, 95(9): 1-9, 2012; Published online in Wiley Online Library (wileyonlinelibrary.com). DOI 10.1002/ecj.11420",
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