Correlation between mechanical and dielectric relaxation processes in epoxy resin composites with nano-and micro-fillers

Mayumi Hyuga, Toshikatsu Tanaka, Yoshimichi Ohki, Takahiro Imai, Miyuki Harada, Mitsukazu Ochi

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

Effects of addition of nano-sized and micro-sized fillers into epoxy resin on its mechanical and dielectric relaxation phenomena were examined. The glass transition temperature (T g) decreases when a small content of nanoclay modified by octadecylamine was added, while the decrease in T g is suppressed when the nanoclay was modified by dimethyldodecylamine. On the other hand, T g increases when microsilica was added abundantly. At temperatures above T g, both mechanical and dielectric relaxations are accelerated in samples with octadecylamine-modified nanoclay, while the acceleration does not occur in samples with nanoclay modified by dimethyldodecylamine. Both relaxations are restricted in composites with abundant microsilica. Therefore, co-addition of dimethyldodecylamine-modified nanoclay and abundant microsilica is adequate in order to make an epoxy resin composite with a high T g and low dielectric loss.

Original languageEnglish
Pages (from-to)1041-1047
Number of pages7
JournalIEEJ Transactions on Fundamentals and Materials
Volume131
Issue number12
DOIs
Publication statusPublished - 2011 Dec 1

Keywords

  • Dielectric properties
  • Epoxy resin
  • Filler modifier
  • Mechanical properties
  • Microcomposite
  • Polymer nanocomposite

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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