Corrosion of Intermetallic Layer and Reliability of Au/Al Bonds

Tomohiro Uno, Kohei Tatsumi

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

In order to clarify the reliability on the mechanical and electrical properties of the bond between Au wire and Al thin pad, corrosion behavior of Au-Al intermetallic formed at the bond interface in the molding resin were investigated. The bonds were annealed at several elevated temperatures, T (423-573 K). Typical degradation was recognized by a decrease in bond strength as well as a remarkable increase in electrical resistance. The molding resin has great influence on the corrosion. Bi-phenyl (BP) epoxy resin was found to cause the degradation approximately six times faster than o-cresole novolac (OCN) epoxy. Activation energies of the bond failure were 1.5 eV (T>450 K) and 2.0 eV (7<450 K) in BP resin and 2.3 eV in OCN resin. The corroded part was revealed to be Au4Al intermetallic phase formed in the bond interface. The growth rate of corroded layer was proportional to annealing time t, which indicated the corrosion behavior was not diffusion-controlled. Activation energies of the growth rate of corroded layer in the BP and the OCN resin were 1.6 eV, 2.3 eV, respectively, which were very similar to those of the bond failure. The corrosion reaction of Au4Al and bromide produced minute Au precipitation (fcc) and Al oxide formation. The Al oxide was identified to be amorphous by EDS and electron diffraction.

Original languageEnglish
Pages (from-to)406-415
Number of pages10
JournalNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Volume63
Issue number3
Publication statusPublished - 1999
Externally publishedYes

Fingerprint

resins
Intermetallics
intermetallics
corrosion
Resins
Corrosion
Molding
Oxides
Activation energy
degradation
activation energy
Epoxy Resins
Degradation
Acoustic impedance
oxides
epoxy resins
electrical resistance
Bromides
Epoxy resins
Electron diffraction

Keywords

  • Aluminum oxide
  • Aluminum thin film
  • Bond strength
  • Bromine
  • Corrosion
  • Diffusion
  • Gold
  • Intermetallic formation
  • Molding resin
  • Reliability
  • Wire bonding

ASJC Scopus subject areas

  • Metals and Alloys

Cite this

Corrosion of Intermetallic Layer and Reliability of Au/Al Bonds. / Uno, Tomohiro; Tatsumi, Kohei.

In: Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals, Vol. 63, No. 3, 1999, p. 406-415.

Research output: Contribution to journalArticle

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