Abstract
Cu-Cu direct bonding under help of direct immersion gold (DIG) for multi-die fan-out wafer level package was demonstrated. Cu-Cu direct bonding is a critical technology for high-frequency applications. To solve challenges of conventional methods, the DIG was used. As a result, a cohesion failure was obtained in shear test.
Original language | English |
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Title of host publication | Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 70 |
Number of pages | 1 |
ISBN (Electronic) | 9784904743034 |
DOIs | |
Publication status | Published - 2017 Jun 13 |
Event | 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan Duration: 2017 May 16 → 2017 May 18 |
Other
Other | 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 |
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Country | Japan |
City | Tokyo |
Period | 17/5/16 → 17/5/18 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Industrial and Manufacturing Engineering
- Electronic, Optical and Magnetic Materials
- Surfaces, Coatings and Films