Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition

Hiroyuki Kuwae, Kosuke Yamada, Wataru Momose, Shuichi Shoji, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A low temperature Cu-Cu bonding technique using an atomically thin-Pt intermediate layer deposited by atomic layer deposition (ALD) was recently reported. In this study, we investigated the characteristic of the Cu-Cu quasi-direct bonding using different metal intermediate layers. A thin-Pt or Au intermediate layer were deposited on the Cu surface by ALD in angstrom level. Both the thin-Pt and the Au intermediate layer successfully improved the Cu-Cu bonding strength compared with that without thin-metal intermediate layer. Although Au is widely used as a thick-intermediate layer in conventional Cu-Cu bonding methods, the Cu-Cu quasi-direct bonding with thin-Pt layer obtained three times lager bonding strength (9.52 MPa) than that with thin-Au layer (3.20 MPa). These results are essential for developing low temperature Cu-Cu bonding for highly integrated 3D IC chips.

Original languageEnglish
Title of host publication2019 International Conference on Electronics Packaging, ICEP 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages207-211
Number of pages5
ISBN (Electronic)9784990218867
DOIs
Publication statusPublished - 2019 Apr 1
Event2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan
Duration: 2019 Apr 172019 Apr 20

Publication series

Name2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference2019 International Conference on Electronics Packaging, ICEP 2019
CountryJapan
CityNiigata
Period19/4/1719/4/20

Fingerprint

Atomic layer deposition
Metalloids
Beer
Metals
Temperature

Keywords

  • atomic layer deposition
  • Cu-Cu bonding
  • metal intermidiate layer
  • thermo compression bonding

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys

Cite this

Kuwae, H., Yamada, K., Momose, W., Shoji, S., & Mizuno, J. (2019). Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition. In 2019 International Conference on Electronics Packaging, ICEP 2019 (pp. 207-211). [8733483] (2019 International Conference on Electronics Packaging, ICEP 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2019.8733483

Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition. / Kuwae, Hiroyuki; Yamada, Kosuke; Momose, Wataru; Shoji, Shuichi; Mizuno, Jun.

2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 207-211 8733483 (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kuwae, H, Yamada, K, Momose, W, Shoji, S & Mizuno, J 2019, Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition. in 2019 International Conference on Electronics Packaging, ICEP 2019., 8733483, 2019 International Conference on Electronics Packaging, ICEP 2019, Institute of Electrical and Electronics Engineers Inc., pp. 207-211, 2019 International Conference on Electronics Packaging, ICEP 2019, Niigata, Japan, 19/4/17. https://doi.org/10.23919/ICEP.2019.8733483
Kuwae H, Yamada K, Momose W, Shoji S, Mizuno J. Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition. In 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 207-211. 8733483. (2019 International Conference on Electronics Packaging, ICEP 2019). https://doi.org/10.23919/ICEP.2019.8733483
Kuwae, Hiroyuki ; Yamada, Kosuke ; Momose, Wataru ; Shoji, Shuichi ; Mizuno, Jun. / Cu-Cu Quasi-Direct Bonding with Atomically Thin-Au and Pt Intermediate Layer Using Atomic Layer Deposition. 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 207-211 (2019 International Conference on Electronics Packaging, ICEP 2019).
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