Cyclo-olefin polymer direct bonding using low temperature plasma activation bonding

Jun Mizuno, Sharon Farrens, Hiroyuki Ishida, Viorel Dragoi, Hidetoshi Shinohara, Takafumi Suzuki, Masanori Ishizuka, Thomas Glinsner, Shuichi Shoji

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

Low temperature direct bonding method of Cyclo-Olefin Polymer (COP) plates (20mm × 40mm × 2.0mm) has been developed employing surface plasma treatment with various gases such as N2, O2, and 10%-H2/Ar. Surface energy of the bonded interface has been measured by razor blade method. Reasonable bonding strength for flow devices was achieved even at room temperature. The contact angle cmeasurements on the sample surfaces after plasma exposure indicated that the plasma activated surfaces became hydrophilic and this activated state lasted for longer than 2 months. This method is useful to fabricate micro-flow devices for single-molecule level optical bio-detection systems that requires less residual stress and deformation after bonding.

Original languageEnglish
Title of host publicationProceedings - 2005 International Conference on MEMS, NANO and Smart Systems, ICMENS 2005
Pages346-349
Number of pages4
DOIs
Publication statusPublished - 2005 Dec 1
Event2005 International Conference on MEMS, NANO and Smart Systems, ICMENS 2005 - Banff, Alberta, Canada
Duration: 2006 Jul 242006 Jul 27

Publication series

NameProceedings - 2005 International Conference on MEMS, NANO and Smart Systems, ICMENS 2005

Conference

Conference2005 International Conference on MEMS, NANO and Smart Systems, ICMENS 2005
CountryCanada
CityBanff, Alberta
Period06/7/2406/7/27

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Keywords

  • Activation
  • Bonding
  • COP
  • Micro-channel
  • Plasma

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Mizuno, J., Farrens, S., Ishida, H., Dragoi, V., Shinohara, H., Suzuki, T., Ishizuka, M., Glinsner, T., & Shoji, S. (2005). Cyclo-olefin polymer direct bonding using low temperature plasma activation bonding. In Proceedings - 2005 International Conference on MEMS, NANO and Smart Systems, ICMENS 2005 (pp. 346-349). [1540849] (Proceedings - 2005 International Conference on MEMS, NANO and Smart Systems, ICMENS 2005). https://doi.org/10.1109/ICMENS.2005.37