De-bondable SiC–SiC wafer bonding via an intermediate Ni nano-film

Fengwen Mu*, Miyuki Uomoto, Takehito Shimatsu, Yinghui Wang, Kenichi Iguchi, Haruo Nakazawa, Yoshikazu Takahashi, Eiji Higurashi, Tadatomo Suga

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

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Engineering & Materials Science

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