Degradation in Dielectric Behavior of Soft Epoxy Resin by Concurrent Aging with Heat and Radiation

Hiroyuki Ishii; Hikaru Yamaguchi; Keigo Mori; Naoshi Hirai; Yoshimichi Ohki

doi:10.1109/CEIDP47102.2019.9010557

Degradation in Dielectric Behavior of Soft Epoxy Resin by Concurrent Aging with Heat and Radiation

Hiroyuki Ishii, Hikaru Yamaguchi, Keigo Mori, Naoshi Hirai, Yoshimichi Ohki

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

The soft epoxy resin (SE) and the hard epoxy resin (HE) used in the nuclear power plants were simultaneously given heat and radiation. The glass transition temperature (T_g), indenter modulus (IM), and complex permittivity were measured. The difference in Tg between SE and HE is very significant, which exerts a great deal of influence on the degradation of SE and HE. While the IM and complex permittivity of HE are hardly affected by the degradation, SE becomes hard and its charge transport becomes less active.

Original language	English
Title of host publication	2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	18-21
Number of pages	4
ISBN (Electronic)	9781728131214
DOIs	https://doi.org/10.1109/CEIDP47102.2019.9010557
Publication status	Published - 2019 Oct
Event	2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Richland, United States Duration: 2019 Oct 20 → 2019 Oct 23

Publication series

Name	Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
Volume	2019-October
ISSN (Print)	0084-9162

Conference

Conference	2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019
Country/Territory	United States
City	Richland
Period	19/10/20 → 19/10/23

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/CEIDP47102.2019.9010557

Cite this

Ishii, H., Yamaguchi, H., Mori, K., Hirai, N., & Ohki, Y. (2019). Degradation in Dielectric Behavior of Soft Epoxy Resin by Concurrent Aging with Heat and Radiation. In 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings (pp. 18-21). [9010557] (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP; Vol. 2019-October). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CEIDP47102.2019.9010557

Degradation in Dielectric Behavior of Soft Epoxy Resin by Concurrent Aging with Heat and Radiation. / Ishii, Hiroyuki; Yamaguchi, Hikaru; Mori, Keigo et al.

2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. p. 18-21 9010557 (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP; Vol. 2019-October).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ishii, H, Yamaguchi, H, Mori, K, Hirai, N & Ohki, Y 2019, Degradation in Dielectric Behavior of Soft Epoxy Resin by Concurrent Aging with Heat and Radiation. in 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings., 9010557, Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP, vol. 2019-October, Institute of Electrical and Electronics Engineers Inc., pp. 18-21, 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019, Richland, United States, 19/10/20. https://doi.org/10.1109/CEIDP47102.2019.9010557

Ishii H, Yamaguchi H, Mori K, Hirai N , Ohki Y. Degradation in Dielectric Behavior of Soft Epoxy Resin by Concurrent Aging with Heat and Radiation. In 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2019. p. 18-21. 9010557. (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP). doi: 10.1109/CEIDP47102.2019.9010557

Ishii, Hiroyuki ; Yamaguchi, Hikaru ; Mori, Keigo et al. / Degradation in Dielectric Behavior of Soft Epoxy Resin by Concurrent Aging with Heat and Radiation. 2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 18-21 (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP).

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abstract = "The soft epoxy resin (SE) and the hard epoxy resin (HE) used in the nuclear power plants were simultaneously given heat and radiation. The glass transition temperature (Tg), indenter modulus (IM), and complex permittivity were measured. The difference in Tg between SE and HE is very significant, which exerts a great deal of influence on the degradation of SE and HE. While the IM and complex permittivity of HE are hardly affected by the degradation, SE becomes hard and its charge transport becomes less active.",

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AB - The soft epoxy resin (SE) and the hard epoxy resin (HE) used in the nuclear power plants were simultaneously given heat and radiation. The glass transition temperature (Tg), indenter modulus (IM), and complex permittivity were measured. The difference in Tg between SE and HE is very significant, which exerts a great deal of influence on the degradation of SE and HE. While the IM and complex permittivity of HE are hardly affected by the degradation, SE becomes hard and its charge transport becomes less active.

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Degradation in Dielectric Behavior of Soft Epoxy Resin by Concurrent Aging with Heat and Radiation

Abstract

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