Degradation in Dielectric Behavior of Soft Epoxy Resin by Concurrent Aging with Heat and Radiation

Hiroyuki Ishii, Hikaru Yamaguchi, Keigo Mori, Naoshi Hirai, Yoshimichi Ohki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The soft epoxy resin (SE) and the hard epoxy resin (HE) used in the nuclear power plants were simultaneously given heat and radiation. The glass transition temperature (Tg), indenter modulus (IM), and complex permittivity were measured. The difference in Tg between SE and HE is very significant, which exerts a great deal of influence on the degradation of SE and HE. While the IM and complex permittivity of HE are hardly affected by the degradation, SE becomes hard and its charge transport becomes less active.

Original languageEnglish
Title of host publication2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages18-21
Number of pages4
ISBN (Electronic)9781728131214
DOIs
Publication statusPublished - 2019 Oct
Event2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Richland, United States
Duration: 2019 Oct 202019 Oct 23

Publication series

NameAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
Volume2019-October
ISSN (Print)0084-9162

Conference

Conference2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019
CountryUnited States
CityRichland
Period19/10/2019/10/23

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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