Denser and taller carbon nanotube arrays on Cu foils useable as thermal interface materials

Nuri Na, Kei Hasegawa, Xiaosong Zhou, Mizuhisa Nihei, Suguru Noda

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    To achieve denser and taller carbon nanotube (CNT) arrays on Cu foils, catalyst and chemical vapor deposition (CVD) conditions were carefully engineered. CNTs were grown to ∼50μm using Fe/TiN/Ta catalysts in which Ta and TiN acted as diffusion barriers for Cu and Ta, respectively. A tradeoff was found between the mass density and height of the CNTarrays, and CNTarrays with a mass density of 0.30 g cm<sup>-3</sup> and height of 45μm were achieved under optimized conditions. Thermal interface materials (TIMs) with CNT array/Cu foil/CNT array structures showed decreasing thermal resistance from 86 to 24mm<sup>2</sup>KW<sup>-1</sup> with increasing CNT array mass densities from 0.07-0.08 to 0.19-0.26 g cm<sup>-3</sup> for Cu and Al blocks with surfaces as rough as 20-30 μm. The best CNT/Cu/CNT TIMs showed thermal resistance values comparable to that of a typical indium sheet TIM.

    Original languageEnglish
    Article number095102
    JournalJapanese Journal of Applied Physics
    Issue number9
    Publication statusPublished - 2015 Sep 1


    ASJC Scopus subject areas

    • Engineering(all)
    • Physics and Astronomy(all)

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