With the use of a device simulator, we show that an ESD protection circuit whose junction filled with contacts is suited to a scaled STI process having thin n junction with n+ being implanted from contact holes. We have confirmed by measurements that the protection has sufficient robustness.
|Number of pages||1|
|Journal||IEEE Transactions on Electronics Packaging Manufacturing|
|Publication status||Published - 2000|
ASJC Scopus subject areas
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering