Abstract
With the use of a device simulator, we show that an ESD protection circuit whose junction filled with contacts is suited to a scaled STI process having thin n junction with n+ being implanted from contact holes. We have confirmed by measurements that the protection has sufficient robustness.
Original language | English |
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Pages (from-to) | 235 |
Number of pages | 1 |
Journal | IEEE Transactions on Electronics Packaging Manufacturing |
Volume | 23 |
Issue number | 4 |
DOIs | |
Publication status | Published - 2000 |
Externally published | Yes |
ASJC Scopus subject areas
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering