Design Optimization of Fin Shape of Heat Sinks for Enhanced Cooling Performance

Hikaru Igarashi*, Masanori Hirota, Makoto Yoshida, Tomoyuki Miyashita

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Heat sinks are well-known mechanisms aiding to dissipate heat efficiently. In this study, we designed and evaluated the cooling performance of heat sinks with diverse fin geometries, base materials, and fans. Also, we optimized the performance by using design optimization of the variables related to the shape of fins. Thus, by changing the fin geometries of the heat sink, adding trenches to the straight fins, and the related modifications, it was found that the optimized heat sink achieves a higher cooling performance than the (baseline) straight-fin heat sink. We also investigated the relationship between the depth of the trench and the cooling performance to find the optimal parameters.

Original languageEnglish
Title of host publication2022 International Conference on Electronics Packaging, ICEP 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages105-106
Number of pages2
ISBN (Electronic)9784991191138
DOIs
Publication statusPublished - 2022
Event21st International Conference on Electronics Packaging, ICEP 2022 - Sapporo, Japan
Duration: 2022 May 112022 May 14

Publication series

Name2022 International Conference on Electronics Packaging, ICEP 2022

Conference

Conference21st International Conference on Electronics Packaging, ICEP 2022
Country/TerritoryJapan
CitySapporo
Period22/5/1122/5/14

Keywords

  • Air-cooling
  • Design Optimization
  • Heat Sink
  • Thermal Resistance

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

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