Design Optimization of power module structure for inductance reduction

Masaki Akimoto*, Makoto Yoshida, Tomoyuki Miyashita

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

There is an unintended inductance called stray inductance in the power module. For modules with a switching function, the inductance should be reduced to make power loss during overshoot smaller. In this experiment, design variables were defined as the structure of the module, and the inductance was calculated from design variables. The design optimization was performed by the response surface methodology. As a result of calculating the performance for the optimized structure, the inductance was confirmed to be reduced by 12.1% from the original structure. The contribution distribution of each design variable to the inductance was also obtained.

Original languageEnglish
Title of host publication2022 International Conference on Electronics Packaging, ICEP 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages153-154
Number of pages2
ISBN (Electronic)9784991191138
DOIs
Publication statusPublished - 2022
Event21st International Conference on Electronics Packaging, ICEP 2022 - Sapporo, Japan
Duration: 2022 May 112022 May 14

Publication series

Name2022 International Conference on Electronics Packaging, ICEP 2022

Conference

Conference21st International Conference on Electronics Packaging, ICEP 2022
Country/TerritoryJapan
CitySapporo
Period22/5/1122/5/14

Keywords

  • D-optimal
  • contribution analysis
  • design optimization
  • design variables
  • response surface method
  • stray inductance

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

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