Detection of ion migration in composites for printed circuit boards by the pulsed electroacoustic method

M. Natsui, Y. Echigo, T. Tanaka, Y. Ohki, T. Maeno

Research output: Contribution to conferencePaperpeer-review

8 Citations (Scopus)

Abstract

Pulsed electroacoustic (PEA) method is applied as a nondestructive technique to detect ion migration that progresses to the thickness direction in insulation composites for printed circuit boards. In both cases of a paper/phenol-resin composite and a glass/epoxy-resin composite, penetration of Cu migration into the bulk after aging was confirmed. Namely, a shift of the peak location of positive charge, which corresponds to the progress of migration in the aged composite, is observable by the PEA method.

Original languageEnglish
Pages376-379
Number of pages4
DOIs
Publication statusPublished - 2008 Dec 31
Event2008 International Symposium on Electrical Insulating Materials, ISEIM 2008 - Yokkaichi, Japan
Duration: 2008 Sep 72008 Sep 11

Conference

Conference2008 International Symposium on Electrical Insulating Materials, ISEIM 2008
CountryJapan
CityYokkaichi
Period08/9/708/9/11

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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