Developing a leading practical application for 3D IC chip stacking technology: How to progress from fundamental technology to application technology

Masahiro Aoyagi; Fumito Imura; Fumiki Kato; Katsuya Kikuchi; Naoya Watanabe; Motohiro Suzuki; Hiroshi Nakagawa; Yoshikuni Okada; Tokihiko Yokoshima; Yasuhiro Yamaji; Shunsuke Nemoto; Tung Thanh Bui; Samson Melamed

doi:10.5571/SYNTHENG.9.1_1

Developing a leading practical application for 3D IC chip stacking technology: How to progress from fundamental technology to application technology

Masahiro Aoyagi, Fumito Imura, Fumiki Kato, Katsuya Kikuchi, Naoya Watanabe, Motohiro Suzuki, Hiroshi Nakagawa, Yoshikuni Okada, Tokihiko Yokoshima, Yasuhiro Yamaji, Shunsuke Nemoto, Tung Thanh Bui, Samson Melamed

Research Organization for Nano & Life Innovation

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

Abstract

3D IC chip stacking technology, which is a technology to vertically stack multiple IC chips such as CMOS, MEMS and power IC chips, is expected to be one of future electronic device integration technologies, because integration along the additional vertical dimension affords efficient use of space and innovation of system architecture. We developed fundamental technology of high density integration for 3D IC chip stacking. To accelerate industrial applications of this technology, a mass-production process was developed in collaboration with a manufacturing equipment company.

Original language	English
Journal	Synthesiology
Volume	9
Issue number	1
DOIs	https://doi.org/10.5571/SYNTHENG.9.1_1
Publication status	Published - 2016 Jun 1

Keywords

3D stacking
IC
Packaging
Semiconductor device
TSV

ASJC Scopus subject areas

Engineering(all)
Social Sciences(all)

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.5571/SYNTHENG.9.1_1

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Aoyagi, M., Imura, F., Kato, F., Kikuchi, K., Watanabe, N., Suzuki, M., Nakagawa, H., Okada, Y., Yokoshima, T., Yamaji, Y., Nemoto, S., Bui, T. T., & Melamed, S. (2016). Developing a leading practical application for 3D IC chip stacking technology: How to progress from fundamental technology to application technology. Synthesiology, 9(1). https://doi.org/10.5571/SYNTHENG.9.1_1

Aoyagi, M, Imura, F, Kato, F, Kikuchi, K, Watanabe, N, Suzuki, M, Nakagawa, H, Okada, Y, Yokoshima, T, Yamaji, Y, Nemoto, S, Bui, TT & Melamed, S 2016, 'Developing a leading practical application for 3D IC chip stacking technology: How to progress from fundamental technology to application technology', Synthesiology, vol. 9, no. 1. https://doi.org/10.5571/SYNTHENG.9.1_1

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Developing a leading practical application for 3D IC chip stacking technology: How to progress from fundamental technology to application technology

Abstract

Keywords

ASJC Scopus subject areas

UN SDGs

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