Developing an application for 3D IC chip stacking technology: How to shift from fundamental to practical technology

Masahiro Aoyagi, Fumito Imura, Fumiki Kato, Katsuya Kikuchi, Naoya Watanabe, Motohiro Suzuki, Hiroshi Nakagawa, Yoshikuni Okada, Tokihiko Yokoshima, Yasuhiro Yamaji, Shunsuke Nemoto, Bui Thanh Tung, Melamed Samson

Research output: Contribution to journalArticle

Abstract

3D IC chip stacking technology is expected to be the future of electronic device integration technology, because integration along the additional dimension affords efficient use of space and improvement of system architecture. We developed fundamental technology of high density integration for 3D IC chip stacking. To facilitate applications of this technology, a mass-production process was developed in collaboration with a production system company.

Original languageEnglish
Pages (from-to)1-14
Number of pages14
JournalSynthesiology
Volume9
Issue number1
DOIs
Publication statusPublished - 2016 Mar 19

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Keywords

  • 3D stacking
  • IC
  • Packaging
  • Semiconductor device
  • TSV

ASJC Scopus subject areas

  • Engineering(all)
  • General

Cite this

Aoyagi, M., Imura, F., Kato, F., Kikuchi, K., Watanabe, N., Suzuki, M., Nakagawa, H., Okada, Y., Yokoshima, T., Yamaji, Y., Nemoto, S., Tung, B. T., & Samson, M. (2016). Developing an application for 3D IC chip stacking technology: How to shift from fundamental to practical technology. Synthesiology, 9(1), 1-14. https://doi.org/10.5571/synth.9.1_1