Development and evaluation of SiC inverter using Ni micro plating bonding power module

Akihiro Kawagoe*, Tomoya Itose, Akihiro Imakiire, Masahiro Kozako, Masayuki Hikita, Kohei Tatsumi, Tomonori Iizuka, Isamu Morisako, Nobuaki Sato, Koji Shimizu, Kazutoshi Ueda, Kazuhiko Sugiura, Kazuhiro Tsuruta, Keiji Toda

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Development and evaluation of SiC inverter using Ni micro plating bonding power module'. Together they form a unique fingerprint.

Engineering & Materials Science

Chemical Compounds