Development of Bi electrodeposition process for fabricating micro absorber array for high sensitive X-ray imaging sensor

Hirotaka Sato, Hideomi Kobayashi, Hiroyuki Kudo, Toshimitsu Izumi, Takayuki Homma, Tetsuya Osaka, Shuichi Shoji, Yoshitaka Ishisaki, Ryuichi Fujimoto, Kazuhisa Mitsuda

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

Microscale Bi electrodeposition process was developed to fabricate the array of mushroom-shaped absorbers for the high sensitive X-ray imaging sensor, so called X-ray microcalorimeter array. The bath composition and operating conditions for Bi electrodeposition was optimized, and sufficient bath stability and surface smoothness of the deposits were achieved by applying the additives such as diethylenetriamine pentaacetic acid and sodium n-dodecyl sulfate with appropriate concentration. By applying the two-step exposure steps for the "stem" part and the "roof" part, the mold to deposit the mushroom-shaped microstructure was formed from single-layered photoresist coating. The absorber array was successfully fabricated by the sequential processes of Bi electrodeposition into the mold, precise polishing, and mold removal.

Original languageEnglish
Pages (from-to)424-426
Number of pages3
JournalElectrochemistry
Volume72
Issue number6
Publication statusPublished - 2004 Jun

Fingerprint

Electrodeposition
Imaging techniques
X rays
Sensors
Deposits
Pentetic Acid
Sodium dodecyl sulfate
Photoresists
Fungi
Polishing
Roofs
Coatings
Microstructure
Acids
Chemical analysis

Keywords

  • Bi Electrodeposition
  • MEMS
  • Micromachining
  • X-ray Imaging

ASJC Scopus subject areas

  • Electrochemistry

Cite this

Development of Bi electrodeposition process for fabricating micro absorber array for high sensitive X-ray imaging sensor. / Sato, Hirotaka; Kobayashi, Hideomi; Kudo, Hiroyuki; Izumi, Toshimitsu; Homma, Takayuki; Osaka, Tetsuya; Shoji, Shuichi; Ishisaki, Yoshitaka; Fujimoto, Ryuichi; Mitsuda, Kazuhisa.

In: Electrochemistry, Vol. 72, No. 6, 06.2004, p. 424-426.

Research output: Contribution to journalArticle

Sato, H, Kobayashi, H, Kudo, H, Izumi, T, Homma, T, Osaka, T, Shoji, S, Ishisaki, Y, Fujimoto, R & Mitsuda, K 2004, 'Development of Bi electrodeposition process for fabricating micro absorber array for high sensitive X-ray imaging sensor', Electrochemistry, vol. 72, no. 6, pp. 424-426.
Sato, Hirotaka ; Kobayashi, Hideomi ; Kudo, Hiroyuki ; Izumi, Toshimitsu ; Homma, Takayuki ; Osaka, Tetsuya ; Shoji, Shuichi ; Ishisaki, Yoshitaka ; Fujimoto, Ryuichi ; Mitsuda, Kazuhisa. / Development of Bi electrodeposition process for fabricating micro absorber array for high sensitive X-ray imaging sensor. In: Electrochemistry. 2004 ; Vol. 72, No. 6. pp. 424-426.
@article{1394302b2c994ed9b4e59cc6cf8ec44a,
title = "Development of Bi electrodeposition process for fabricating micro absorber array for high sensitive X-ray imaging sensor",
abstract = "Microscale Bi electrodeposition process was developed to fabricate the array of mushroom-shaped absorbers for the high sensitive X-ray imaging sensor, so called X-ray microcalorimeter array. The bath composition and operating conditions for Bi electrodeposition was optimized, and sufficient bath stability and surface smoothness of the deposits were achieved by applying the additives such as diethylenetriamine pentaacetic acid and sodium n-dodecyl sulfate with appropriate concentration. By applying the two-step exposure steps for the {"}stem{"} part and the {"}roof{"} part, the mold to deposit the mushroom-shaped microstructure was formed from single-layered photoresist coating. The absorber array was successfully fabricated by the sequential processes of Bi electrodeposition into the mold, precise polishing, and mold removal.",
keywords = "Bi Electrodeposition, MEMS, Micromachining, X-ray Imaging",
author = "Hirotaka Sato and Hideomi Kobayashi and Hiroyuki Kudo and Toshimitsu Izumi and Takayuki Homma and Tetsuya Osaka and Shuichi Shoji and Yoshitaka Ishisaki and Ryuichi Fujimoto and Kazuhisa Mitsuda",
year = "2004",
month = "6",
language = "English",
volume = "72",
pages = "424--426",
journal = "Electrochemistry",
issn = "1344-3542",
publisher = "Electrochemical Society of Japan",
number = "6",

}

TY - JOUR

T1 - Development of Bi electrodeposition process for fabricating micro absorber array for high sensitive X-ray imaging sensor

AU - Sato, Hirotaka

AU - Kobayashi, Hideomi

AU - Kudo, Hiroyuki

AU - Izumi, Toshimitsu

AU - Homma, Takayuki

AU - Osaka, Tetsuya

AU - Shoji, Shuichi

AU - Ishisaki, Yoshitaka

AU - Fujimoto, Ryuichi

AU - Mitsuda, Kazuhisa

PY - 2004/6

Y1 - 2004/6

N2 - Microscale Bi electrodeposition process was developed to fabricate the array of mushroom-shaped absorbers for the high sensitive X-ray imaging sensor, so called X-ray microcalorimeter array. The bath composition and operating conditions for Bi electrodeposition was optimized, and sufficient bath stability and surface smoothness of the deposits were achieved by applying the additives such as diethylenetriamine pentaacetic acid and sodium n-dodecyl sulfate with appropriate concentration. By applying the two-step exposure steps for the "stem" part and the "roof" part, the mold to deposit the mushroom-shaped microstructure was formed from single-layered photoresist coating. The absorber array was successfully fabricated by the sequential processes of Bi electrodeposition into the mold, precise polishing, and mold removal.

AB - Microscale Bi electrodeposition process was developed to fabricate the array of mushroom-shaped absorbers for the high sensitive X-ray imaging sensor, so called X-ray microcalorimeter array. The bath composition and operating conditions for Bi electrodeposition was optimized, and sufficient bath stability and surface smoothness of the deposits were achieved by applying the additives such as diethylenetriamine pentaacetic acid and sodium n-dodecyl sulfate with appropriate concentration. By applying the two-step exposure steps for the "stem" part and the "roof" part, the mold to deposit the mushroom-shaped microstructure was formed from single-layered photoresist coating. The absorber array was successfully fabricated by the sequential processes of Bi electrodeposition into the mold, precise polishing, and mold removal.

KW - Bi Electrodeposition

KW - MEMS

KW - Micromachining

KW - X-ray Imaging

UR - http://www.scopus.com/inward/record.url?scp=3142695400&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=3142695400&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:3142695400

VL - 72

SP - 424

EP - 426

JO - Electrochemistry

JF - Electrochemistry

SN - 1344-3542

IS - 6

ER -