Development of Bi electrodeposition process for fabricating micro absorber array for high sensitive X-ray imaging sensor

Hirotaka Sato, Hideomi Kobayashi, Hiroyuki Kudo, Toshimitsu Izumi, Takayuki Homma, Tetsuya Osaka, Shuichi Shoji, Yoshitaka Ishisaki, Ryuichi Fujimoto, Kazuhisa Mitsuda

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

Microscale Bi electrodeposition process was developed to fabricate the array of mushroom-shaped absorbers for the high sensitive X-ray imaging sensor, so called X-ray microcalorimeter array. The bath composition and operating conditions for Bi electrodeposition was optimized, and sufficient bath stability and surface smoothness of the deposits were achieved by applying the additives such as diethylenetriamine pentaacetic acid and sodium n-dodecyl sulfate with appropriate concentration. By applying the two-step exposure steps for the "stem" part and the "roof" part, the mold to deposit the mushroom-shaped microstructure was formed from single-layered photoresist coating. The absorber array was successfully fabricated by the sequential processes of Bi electrodeposition into the mold, precise polishing, and mold removal.

Original languageEnglish
Pages (from-to)424-426
Number of pages3
JournalElectrochemistry
Volume72
Issue number6
Publication statusPublished - 2004 Jun 1

Keywords

  • Bi Electrodeposition
  • MEMS
  • Micromachining
  • X-ray Imaging

ASJC Scopus subject areas

  • Electrochemistry

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    Sato, H., Kobayashi, H., Kudo, H., Izumi, T., Homma, T., Osaka, T., Shoji, S., Ishisaki, Y., Fujimoto, R., & Mitsuda, K. (2004). Development of Bi electrodeposition process for fabricating micro absorber array for high sensitive X-ray imaging sensor. Electrochemistry, 72(6), 424-426.