Development of deterioration diagnosis technique for bus Joint in Switchboards with temperature fluctuation

Yoshiyuki Takagi, Hiroshi Inujima

Research output: Contribution to journalArticle

Abstract

We developed deterioration diagnosis technique for bus Joint in Switchboards. Increase of contact resistance by deterioration of a bus joint causes a temperature rise. However, it is difficult to really measure a temperature rise by a minute change of contact resistance. That is a method to detect a change of contact resistance of a bus joint as a temperature fluctuation. We expect that a serious accident such as a short circuit is prevented beforehand by this technique.

Original languageEnglish
Pages (from-to)584-587+4
Journalieej transactions on industry applications
Volume128
Issue number5
DOIs
Publication statusPublished - 2008 Dec 1

Keywords

  • Bus Joint
  • Deterioration diagnosis
  • Switchboard
  • Temperature fluctuation

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Development of deterioration diagnosis technique for bus Joint in Switchboards with temperature fluctuation'. Together they form a unique fingerprint.

  • Cite this