Development of deterioration diagnosis technique for bus Joint in Switchboards with temperature fluctuation

We developed deterioration diagnosis technique for bus Joint in Switchboards. Increase of contact resistance by deterioration of a bus joint causes a temperature rise. However, it is difficult to really measure a temperature rise by a minute change of contact resistance. That is a method to detect a change of contact resistance of a bus joint as a temperature fluctuation. We expect that a serious accident such as a short circuit is prevented beforehand by this technique.