Development of new electrolytic and electroless gold plating processes for electronics applications

Tetsuya Osaka, Yutaka Okinaka, Junji Sasano, Masaru Kato

Research output: Contribution to journalArticle

30 Citations (Scopus)

Abstract

This article reviews results of our investigations, performed over the period of a decade, on gold plating for electronics applications. Three different topics are covered: (1) development of a new, non-cyanide, soft-gold electroplating bath containing both thiosulfate and sulfite as ligands; (2) evaluation of a known cyanide-based, substrate-catalyzed electroless bath for depositing pure soft gold, and subsequent development of an alternative, non-cyanide, substrate-catalyzed bath; and (3) development of a new process to electroplate amorphous hard-gold alloys for probable future applications as a contact material on nano-scale electronic devices.

Original languageEnglish
Pages (from-to)425-437
Number of pages13
JournalScience and Technology of Advanced Materials
Volume7
Issue number5
DOIs
Publication statusPublished - 2006 Jul

Fingerprint

Gold plating
Electroless plating
Gold
Electronic equipment
Electronic scales
Gold Alloys
Gold alloys
Thiosulfates
Sulfites
Cyanides
Electroplating
Substrates
Ligands

Keywords

  • Amorphous gold alloys
  • Electroless plating
  • Electroplating
  • Gold
  • Substrate-catalyzed plating

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Development of new electrolytic and electroless gold plating processes for electronics applications. / Osaka, Tetsuya; Okinaka, Yutaka; Sasano, Junji; Kato, Masaru.

In: Science and Technology of Advanced Materials, Vol. 7, No. 5, 07.2006, p. 425-437.

Research output: Contribution to journalArticle

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