Development of soft x-ray laser irradiation beamline for ablation and damage study

Masahiko Ishino, Thanh Hung Dinh, Noboru Hasegawa, Kazuyuki Sakaue, Takeshi Higashiguchi, Satoshi Ichimaru, Masatoshi Hatayama, Masakazu Washio, Masaharu Nishikino

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The interactions of short pulse lasers with matter are interesting subjects not only in applications such as surface fabrication but also in physical phenomena for study. Optical short pulse lasers have abilities to occur the ablation phenomena accompanying the creation of high temperature, high pressure, and excited states of electrons. The picosecond soft x-ray laser (SXRL) pulse also has ability to occur the ablation. The SXRL having the wavelength of 13.9 nm and duration of 7 ps is one of attractive x-ray source for ablation study, because the ablation threshold obtained with the focused SXRL pulse is much smaller than those obtained with other lasers having longer durations and/or longer wavelengths. The low ablation threshold of a material for the SXRL beam has a possibility of efficient nanometer scale surface machining by an ablation. The ablation study will lead to the physical research and the direct surface machining. In addition, the wavelength of the SXRL is very close to the wavelength of the extreme ultraviolet (EUV) lithography system (λ = 13.5 nm). In the presentation, we report on development of the soft x-ray laser irradiation system. The irradiation system has an intensity monitor based on the Mo/Si multilayer beam splitter. This intensity monitor provides the irradiation energy onto sample surface. The SXRL has an ability to confirm the ablation threshold and to examine the damage property of EUV optical elements, which have the same specifications of those in the EUV lithography. And more, it is possible to evaluate the doses for sensitivity of resists.

Original languageEnglish
Title of host publicationLaser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV
EditorsGediminas Raciukaitis, Carlos Molpeceres, Tetsuya Makimura
PublisherSPIE
ISBN (Electronic)9781510624528
DOIs
Publication statusPublished - 2019 Jan 1
EventLaser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV 2019 - San Francisco, United States
Duration: 2019 Feb 42019 Feb 6

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume10905
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceLaser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV 2019
CountryUnited States
CitySan Francisco
Period19/2/419/2/6

Fingerprint

X-ray Laser
Soft X-ray
x ray lasers
Ablation
Laser beam effects
Irradiation
ablation
Damage
damage
X rays
irradiation
Laser pulses
Wavelength
Extreme ultraviolet lithography
Extreme Ultraviolet Lithography
Short Pulse
Lasers
Laser
pulses
Machining

Keywords

  • ablation
  • evaluation beamline
  • irradiation damage
  • soft x-ray laser

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Ishino, M., Dinh, T. H., Hasegawa, N., Sakaue, K., Higashiguchi, T., Ichimaru, S., ... Nishikino, M. (2019). Development of soft x-ray laser irradiation beamline for ablation and damage study. In G. Raciukaitis, C. Molpeceres, & T. Makimura (Eds.), Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV [109051C] (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 10905). SPIE. https://doi.org/10.1117/12.2513390

Development of soft x-ray laser irradiation beamline for ablation and damage study. / Ishino, Masahiko; Dinh, Thanh Hung; Hasegawa, Noboru; Sakaue, Kazuyuki; Higashiguchi, Takeshi; Ichimaru, Satoshi; Hatayama, Masatoshi; Washio, Masakazu; Nishikino, Masaharu.

Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV. ed. / Gediminas Raciukaitis; Carlos Molpeceres; Tetsuya Makimura. SPIE, 2019. 109051C (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 10905).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ishino, M, Dinh, TH, Hasegawa, N, Sakaue, K, Higashiguchi, T, Ichimaru, S, Hatayama, M, Washio, M & Nishikino, M 2019, Development of soft x-ray laser irradiation beamline for ablation and damage study. in G Raciukaitis, C Molpeceres & T Makimura (eds), Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV., 109051C, Proceedings of SPIE - The International Society for Optical Engineering, vol. 10905, SPIE, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV 2019, San Francisco, United States, 19/2/4. https://doi.org/10.1117/12.2513390
Ishino M, Dinh TH, Hasegawa N, Sakaue K, Higashiguchi T, Ichimaru S et al. Development of soft x-ray laser irradiation beamline for ablation and damage study. In Raciukaitis G, Molpeceres C, Makimura T, editors, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV. SPIE. 2019. 109051C. (Proceedings of SPIE - The International Society for Optical Engineering). https://doi.org/10.1117/12.2513390
Ishino, Masahiko ; Dinh, Thanh Hung ; Hasegawa, Noboru ; Sakaue, Kazuyuki ; Higashiguchi, Takeshi ; Ichimaru, Satoshi ; Hatayama, Masatoshi ; Washio, Masakazu ; Nishikino, Masaharu. / Development of soft x-ray laser irradiation beamline for ablation and damage study. Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV. editor / Gediminas Raciukaitis ; Carlos Molpeceres ; Tetsuya Makimura. SPIE, 2019. (Proceedings of SPIE - The International Society for Optical Engineering).
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