Development of ultra-fine pitch ball bonding technology

Kohei Tatsumi, Tomohiro Uno, Osamu Kitamura, Yasuhide Ohno, Takashi Katsumata, Masayuki Furusawa

Research output: Contribution to conferencePaper

12 Citations (Scopus)

Abstract

Wire bonding technology that can produce more compact and higher density chips without modifying the existing assembly process is desired. This paper discusses reduction of the diameter of ball to be performed at the tip of the wire, the required wire diameter reduction, capillary tip diameter reduction, and attainment of a higher Young's modulus for the wire that can suppress wire sweep in transfer molding. It also indicates that wire bonding for a pitch of 70μm or less can be performed with no problem in reliability of the bonded zone.

Original languageEnglish
Pages295-298
Number of pages4
Publication statusPublished - 1995 Dec 1
EventProceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA
Duration: 1995 Oct 21995 Oct 4

Other

OtherProceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium
CityAustin, TX, USA
Period95/10/295/10/4

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ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

Tatsumi, K., Uno, T., Kitamura, O., Ohno, Y., Katsumata, T., & Furusawa, M. (1995). Development of ultra-fine pitch ball bonding technology. 295-298. Paper presented at Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium, Austin, TX, USA, .