Dielectric breakdown due to hole avalanche in plasma polymer films

K. Ishii, Yoshimichi Ohki, T. Nakano

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    High-field conduction and dielectric breakdown characteristics of plasma-polymerized films of ethylene and trifluoromethane (PPEF) and those of ethylene (PPE) were studied. Based on experimental results on the prebreakdown current, time lag to breakdown, and thickness or electrode metal dependence on dielectric strength, it is shown that the breakdown is caused by hole avalanche and that scattering of holes by fluorine atoms results in higher dielectric strength in PPEF than in PPE.

    Original languageEnglish
    Title of host publicationConference Record of IEEE International Symposium on Electrical Insulation
    PublisherPubl by IEEE
    Pages76-79
    Number of pages4
    Publication statusPublished - 1990
    EventConference Record of the 1990 IEEE International Symposium on Electrical Insulation - Toronto, Ca
    Duration: 1990 Jun 31990 Jun 6

    Other

    OtherConference Record of the 1990 IEEE International Symposium on Electrical Insulation
    CityToronto, Ca
    Period90/6/390/6/6

    Fingerprint

    Electric breakdown
    Polymer films
    Ethylene
    Plasmas
    Fluorine
    Scattering
    Atoms
    Electrodes
    Metals

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Building and Construction

    Cite this

    Ishii, K., Ohki, Y., & Nakano, T. (1990). Dielectric breakdown due to hole avalanche in plasma polymer films. In Conference Record of IEEE International Symposium on Electrical Insulation (pp. 76-79). Publ by IEEE.

    Dielectric breakdown due to hole avalanche in plasma polymer films. / Ishii, K.; Ohki, Yoshimichi; Nakano, T.

    Conference Record of IEEE International Symposium on Electrical Insulation. Publ by IEEE, 1990. p. 76-79.

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Ishii, K, Ohki, Y & Nakano, T 1990, Dielectric breakdown due to hole avalanche in plasma polymer films. in Conference Record of IEEE International Symposium on Electrical Insulation. Publ by IEEE, pp. 76-79, Conference Record of the 1990 IEEE International Symposium on Electrical Insulation, Toronto, Ca, 90/6/3.
    Ishii K, Ohki Y, Nakano T. Dielectric breakdown due to hole avalanche in plasma polymer films. In Conference Record of IEEE International Symposium on Electrical Insulation. Publ by IEEE. 1990. p. 76-79
    Ishii, K. ; Ohki, Yoshimichi ; Nakano, T. / Dielectric breakdown due to hole avalanche in plasma polymer films. Conference Record of IEEE International Symposium on Electrical Insulation. Publ by IEEE, 1990. pp. 76-79
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