Dielectric properties and thermal conductivity of epoxy/AlN composites with several kinds of filler-matrix interfaces

T. Tanaka, Tomonori Iizuka, Yoshimichi Ohki, X. Huang, P. Jiang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Epoxy/AlN composites were prepared using high purity AlN particles with an average size of 1.1 μm. AlN particles were surface-treated with three kinds of silane coupling agents and three kinds of surface-modifiers. Dielectric properties and thermal conductivity were evaluated. As a result, it was found that silane coupling agents with epoxy, mercapto, and amino groups create higher thermal conductivity than surface modifiers such as GO, POSS and hyper-branched polymer. A silane coupling agent with mercapto group and a graphene oxide surface modifier are promising at high and low loading levels, respectively. From the dielectric spectroscopy study, it can be said that interfacial conditions should be improved by finding out proper methods.

Original languageEnglish
Title of host publicationProceedings of IEEE International Conference on Solid Dielectrics, ICSD
Pages377-380
Number of pages4
DOIs
Publication statusPublished - 2013
EventICSD 2013 - Proceedings of the 2013 IEEE International Conference on Solid Dielectrics - Bologna
Duration: 2013 Jun 302013 Jul 4

Other

OtherICSD 2013 - Proceedings of the 2013 IEEE International Conference on Solid Dielectrics
CityBologna
Period13/6/3013/7/4

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Keywords

  • coupling agents
  • high thermal conductivity
  • interfaces
  • multifunctional materials
  • polymer composites

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry
  • Condensed Matter Physics

Cite this

Tanaka, T., Iizuka, T., Ohki, Y., Huang, X., & Jiang, P. (2013). Dielectric properties and thermal conductivity of epoxy/AlN composites with several kinds of filler-matrix interfaces. In Proceedings of IEEE International Conference on Solid Dielectrics, ICSD (pp. 377-380). [6619742] https://doi.org/10.1109/ICSD.2013.6619742