Dielectric properties of epoxy/clay nanocomposites -effects of curing agent and clay dispersion method

N. Tagami, M. Okada, Naoshi Hirai, Yoshimichi Ohki, T. Tanaka, T. Imai, M. Harada, M. Ochi

Research output: Contribution to journalArticle

58 Citations (Scopus)

Abstract

Effects of the differences in the curing agent and filler dispersion method on the dielectric properties were examined for epoxy/clay nanocomposites. Irrespective of the clay dispersion method, relative permittivity and electrical conductivity are higher in the samples cured with the amine. Moreover, negative heterocharge accumulates in the vicinity of the anode in the amine-cured samples, whereas positive homocharge accumulates in the acid anhydride-cured samples. From the results of UV photon absorption and PL measurement, the bandgap or the energy at which the photon absorption increases drastically is smaller in the amine-cured samples than in the acid anhydride-cured samples. Ion migration can occur easily in the amine-cured samples whose electrical conductivity and relative permittivity are higher than the acid anhydride-cured samples. The curing agent gives the strongest effect, while the existence of clay affects secondly and the filler dispersion method has the weakest effect.

Original languageEnglish
Pages (from-to)24-32
Number of pages9
JournalIEEE Transactions on Dielectrics and Electrical Insulation
Volume15
Issue number1
DOIs
Publication statusPublished - 2008 Feb

Fingerprint

Dielectric properties
Curing
Amines
Nanocomposites
Clay
Acids
Fillers
Permittivity
Photons
Anodes
Energy gap
Ions
Electric Conductivity

Keywords

  • Conductivity
  • Curing agent
  • Epoxy nanocomposite
  • Filler dispersion method
  • Permittivity
  • Space charge distribution

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Dielectric properties of epoxy/clay nanocomposites -effects of curing agent and clay dispersion method. / Tagami, N.; Okada, M.; Hirai, Naoshi; Ohki, Yoshimichi; Tanaka, T.; Imai, T.; Harada, M.; Ochi, M.

In: IEEE Transactions on Dielectrics and Electrical Insulation, Vol. 15, No. 1, 02.2008, p. 24-32.

Research output: Contribution to journalArticle

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AU - Imai, T.

AU - Harada, M.

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