マイクロギャップ電極デバイスを用いたシリカ/エポキシ界面の破壊経路の直接観察

Translated title of the contribution: Direct observation of dielectric breakdown path at silica/epoxy interface with a micro-gap electrode device

Rina Sankawa, Takuya Onishi, Kohei Takahashi, Motohiro Tomita, Kotaro Mura, Takahiro Nakamura, Tetsuo Yoshimitsu, Takahiro Imai, Takanobu Watanabe

Research output: Contribution to journalArticle

Abstract

We develop a micro-gap electrode device on quartz substrate to investigate the dielectric breakdown resistance on constrained layer of silica/epoxy interface. After application of stress, the device is cut at the middle of the micro-gap by laser dicing to observe the cross-section, and the cross-section shows where the breakdown occurs in the vicinity of the silica/epoxy interface at sub-micron scale. These results give us a clue to understand the effect of nano-fillers on the dielectric breakdown of nano-composite materials.

Translated title of the contributionDirect observation of dielectric breakdown path at silica/epoxy interface with a micro-gap electrode device
Original languageJapanese
Pages (from-to)64-69
Number of pages6
JournalIEEJ Transactions on Fundamentals and Materials
Volume140
Issue number2
DOIs
Publication statusPublished - 2020

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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