Direct shaping of alumina ceramics by electrophoretic deposition using conductive polymer-coated ceramic substrates

T. Uchikoshi, S. Furumi, T. S. Suzuki, Y. Sakka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Cathodic electrophoretic deposition of bimodal alumina suspension was performed using conductive polypyrrole (Ppy) film as an electrode. The coating of the Ppy on nonconductive ceramic substrates was performed by polymerization of pyrrole (Py) in an aqueous solution. The relative green density of the deposits measured by Archimedes' method was 68 %. Alumina ceramics were obtained by sintering the deposits together with the Ppy coated ceramic substrates in air.

Original languageEnglish
Title of host publicationAdvanced Materials and Processing IV - Selected, peer reviewed papers presented at the 4th International Conference on Advanced Materials and Processing
PublisherTrans Tech Publications
Pages227-230
Number of pages4
ISBN (Print)0878494669, 9780878494668
Publication statusPublished - 2007 Jan 1
Externally publishedYes
Event4th International Conference on Advanced Materials and Processing, ICAMP-4 - Hamilton, New Zealand
Duration: 2006 Dec 102006 Dec 13

Publication series

NameAdvanced Materials Research
Volume29-30
ISSN (Print)1022-6680

Conference

Conference4th International Conference on Advanced Materials and Processing, ICAMP-4
CountryNew Zealand
CityHamilton
Period06/12/1006/12/13

Keywords

  • Alumina
  • Electrode
  • Electrophoretic deposition
  • Polypyrrole

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Uchikoshi, T., Furumi, S., Suzuki, T. S., & Sakka, Y. (2007). Direct shaping of alumina ceramics by electrophoretic deposition using conductive polymer-coated ceramic substrates. In Advanced Materials and Processing IV - Selected, peer reviewed papers presented at the 4th International Conference on Advanced Materials and Processing (pp. 227-230). (Advanced Materials Research; Vol. 29-30). Trans Tech Publications.