Effect of carbon content on the electrical resistivity of electrodeposited copper

Tetsuya Osaka, Noriyuki Yamachika, Masahiro Yoshino, Madoka Hasegawa, Yoshinori Negishi, Yutaka Okinaka

Research output: Contribution to journalArticle

23 Citations (Scopus)

Abstract

Copper films electrodeposited from acid sulfate baths containing conventional additives used in the damascene process for the fabrication of ultralarge-scale integration interconnects were analyzed quantitatively to investigate the relation between carbon content and electrical resistivity of the deposit. In the as-deposited state, the resistivity of deposits that did not exhibit self-annealing effects in scanning ion microscope examination increased almost linearly with carbon content in the range of 0.002-0.045 wt %. The deposits that exhibited self-annealing effects showed higher resistivity values at identical carbon contents. After self-annealing, resistivity values of all deposits varied almost linearly with carbon content.

Original languageEnglish
JournalElectrochemical and Solid-State Letters
Volume12
Issue number3
DOIs
Publication statusPublished - 2009

Fingerprint

Copper
Carbon
Deposits
copper
electrical resistivity
deposits
carbon
Annealing
annealing
Ion microscopes
ion microscopes
Sulfates
baths
sulfates
Scanning
Fabrication
examination
Acids
acids
fabrication

ASJC Scopus subject areas

  • Electrochemistry
  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Chemical Engineering(all)
  • Physical and Theoretical Chemistry

Cite this

Effect of carbon content on the electrical resistivity of electrodeposited copper. / Osaka, Tetsuya; Yamachika, Noriyuki; Yoshino, Masahiro; Hasegawa, Madoka; Negishi, Yoshinori; Okinaka, Yutaka.

In: Electrochemical and Solid-State Letters, Vol. 12, No. 3, 2009.

Research output: Contribution to journalArticle

Osaka, Tetsuya ; Yamachika, Noriyuki ; Yoshino, Masahiro ; Hasegawa, Madoka ; Negishi, Yoshinori ; Okinaka, Yutaka. / Effect of carbon content on the electrical resistivity of electrodeposited copper. In: Electrochemical and Solid-State Letters. 2009 ; Vol. 12, No. 3.
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