Effect of citric acid and EDTA addition on Cu-In alloy electrochemical deposition

Takahiro Ishizaki, Nagahiro Saito, Akio Fuwa

    Research output: Contribution to journalArticle

    1 Citation (Scopus)

    Abstract

    The standard electrode potential for Cu is 0.34 V and that of In is -0.34 V, which means that their deposition potentials are far apart, making the co-deposition difficult from a simple solution containing Cu and In ions. In order to bring these deposition potentials closer, a complex forming reagent of citric or EDTA is added to the CuSO4-In2(SO4)3 solution. The effect of these reagents was examined by linear sweep voltammetric measurement. An electrochemical deposition experiment of Cu-In alloy was conducted where effect citric acid or EDTA addition, current density and Cu concentration were examined.

    Original languageEnglish
    Pages (from-to)867-870
    Number of pages4
    Journalmaterials transactions, jim
    Volume40
    Issue number9
    Publication statusPublished - 1999

    ASJC Scopus subject areas

    • Engineering(all)

    Fingerprint Dive into the research topics of 'Effect of citric acid and EDTA addition on Cu-In alloy electrochemical deposition'. Together they form a unique fingerprint.

  • Cite this