Effect of citric acid and EDTA addition on Cu-In alloy electrochemical deposition

Takahiro Ishizaki, Nagahiro Saito, Akio Fuwa

    Research output: Contribution to journalArticle

    1 Citation (Scopus)

    Abstract

    The standard electrode potential for Cu is 0.34 V and that of In is -0.34 V, which means that their deposition potentials are far apart, making the co-deposition difficult from a simple solution containing Cu and In ions. In order to bring these deposition potentials closer, a complex forming reagent of citric or EDTA is added to the CuSO4-In2(SO4)3 solution. The effect of these reagents was examined by linear sweep voltammetric measurement. An electrochemical deposition experiment of Cu-In alloy was conducted where effect citric acid or EDTA addition, current density and Cu concentration were examined.

    Original languageEnglish
    Pages (from-to)867-870
    Number of pages4
    Journalmaterials transactions, jim
    Volume40
    Issue number9
    Publication statusPublished - 1999

    Fingerprint

    ethylenediaminetetraacetic acids
    citric acid
    Ethylenediaminetetraacetic acid
    Citric acid
    Edetic Acid
    Citric Acid
    reagents
    Current density
    Ions
    current density
    Electrodes
    electrodes
    ions
    Experiments

    ASJC Scopus subject areas

    • Engineering(all)

    Cite this

    Effect of citric acid and EDTA addition on Cu-In alloy electrochemical deposition. / Ishizaki, Takahiro; Saito, Nagahiro; Fuwa, Akio.

    In: materials transactions, jim, Vol. 40, No. 9, 1999, p. 867-870.

    Research output: Contribution to journalArticle

    Ishizaki, T, Saito, N & Fuwa, A 1999, 'Effect of citric acid and EDTA addition on Cu-In alloy electrochemical deposition', materials transactions, jim, vol. 40, no. 9, pp. 867-870.
    Ishizaki, Takahiro ; Saito, Nagahiro ; Fuwa, Akio. / Effect of citric acid and EDTA addition on Cu-In alloy electrochemical deposition. In: materials transactions, jim. 1999 ; Vol. 40, No. 9. pp. 867-870.
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