We have investigated the effect of Cu addition to the FePt alloy on the ordering kinetics and the coercivities of sputter deposited thin films. By alloying 4at% Cu, the temperature that A1 phase orders to the L10 structure decrease from 500°C to 400°C. The lattice parameters of the L10-ordered phase suggest that Fe atoms are substituted by Cu. The grain size increases by the addition of Cu, suggesting that the decrease of the annealing temperature for ordering is due to the enhanced kinetics of ordering as a result of higher diffusivity obtained from the alloy with the lower melting temperature.
- Thin film
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics