EFFECT OF HEAT-TREATMENT ON THE STRUCTURE AND RESISTIVITY OF ELECTROLESS Ni-W-P ALLOY FILMS.

Ichiro Koiwa, Masahiko Usuda, Tetsuya Osaka

Research output: Contribution to journalArticle

44 Citations (Scopus)

Abstract

An electroless plating bath for amorphous Ni-W-P alloy films was developed and their heat change properties were investigated from the viewpoint of W codeposition effect. The alloy films kept amorphous state with increasing W content even though the P content decreased. Moreover, the films became more amorphous, and their thermal stability increased with an increase of W content in the deposit. The tungsten content was varied from 0 to 20. 8 weight percent (w/o) with a decrease in P content from 14. 0 to 6. 2 w/o by increasing the Na//2WO//4 concentration in the bath.

Original languageEnglish
Pages (from-to)1222-1228
Number of pages7
JournalJournal of the Electrochemical Society
Volume135
Issue number5
Publication statusPublished - 1988 May

Fingerprint

heat treatment
Heat treatment
Tungsten
electrical resistivity
Electroless plating
Amorphous films
Thermodynamic stability
Deposits
baths
plating
tungsten
thermal stability
deposits
heat
Hot Temperature

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

EFFECT OF HEAT-TREATMENT ON THE STRUCTURE AND RESISTIVITY OF ELECTROLESS Ni-W-P ALLOY FILMS. / Koiwa, Ichiro; Usuda, Masahiko; Osaka, Tetsuya.

In: Journal of the Electrochemical Society, Vol. 135, No. 5, 05.1988, p. 1222-1228.

Research output: Contribution to journalArticle

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