Effect of Heat-Treatment on the Structure and Resistivity of Electroless Ni-W-P Alloy Films

Lchiro Koiwa, Masahiko Usuda, Tetsuya Osaka

Research output: Contribution to journalArticle

44 Citations (Scopus)

Abstract

An electroless plating bath for amorphous Ni-W-P alloy films was developed and their heat change properties were investigated from the viewpoint of W codeposition effect. The alloy films kept amorphous state with increasing W content even though the P content decreased. Moreover, the films became more amorphous, and their thermal stability increased with an increase of W content in the deposit. The tungsten content was varied from 0 to 20.8 weight percent (w/o) with a decrease in P content from 14.0 to 6.2 w/o by increasing the Na2WO4concentration in the bath. Two characteristic heat change behaviors were observed in the Ni-W-P alloy films. One was the formation of metastable phase in spite of low P content. The other was direct formation of Ni-W alloy phase. The tungsten codeposition increased the thermal stability of amorphous Ni-W-P alloy films plated from the baths with higher Na2WO4 concentration by suppressing the Ni crystallization prior to the Ni3P compound formation. The thermal changes of resistivity strongly depended on the crystallization of the Ni3P compound and Ni alloy phase. Both crystallization reactions were controlled by the P and W contents in the deposits.

Original languageEnglish
Pages (from-to)1222-1228
Number of pages7
JournalJournal of the Electrochemical Society
Volume135
Issue number5
DOIs
Publication statusPublished - 1988 May

    Fingerprint

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

Cite this