EFFECT OF IMPURE ELEMENTS ON THE STRUCTURES OF SOLIDIFIED COPPER ANODES AND PASSIVATION BEHAVIOR DURING ELECTROREFINING - Cu-O-Vb(As, Sb or Bi SYSTEM AND Cu-S-Vb SYSTEM.

Yukyo Takada, Akio Fuwa

    Research output: Contribution to journalArticle

    Abstract

    In order to investigate the effect of impure elements on the anode passivation behavior during electro-refining process, a relationship between passivation phenomena and solidified structures of synthetic ternary copper anodes, i. e. Cu-O-Vb element (As, Sb or Bi) system and Cu-S-Vb element system, has been investigated. Passivation behavior has been quantified by the passivation time under a certain electro-refining condition. The results obtained have shown that these ternary copper anodes containing two kinds of impure elements (such as oxygen plus one of Vb elements) at around stoichiometric composition ratio for compound formation have the microstructures of least eutectics and the compound tends to precipitate at grain boundaries. It has also shown that such ternary copper anodes exhibit the least tendencies for passivation. A further discussion for this relationship between passivation and microstructures has also been presented.

    Original languageEnglish
    Pages (from-to)177-181
    Number of pages5
    JournalNihon Kogyokaishi
    Volume104
    Issue number1201
    Publication statusPublished - 1988 Mar

      Fingerprint

    ASJC Scopus subject areas

    • Engineering(all)

    Cite this