Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

H. Nishikawa, K. Matsunaga, M. S. Kim, Mikiko Saito, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

High-Temperature joining is a key technology for electronic component assembly and other high-Temperature applications. Recently, focusing on the sintering behavior of metal particles, the joining process using a nanoparticle paste has been proposed as an alternative to establish a high-Temperature joining technology. In this study, a feasibility study has been conducted to determine whether an Au nanoporous sheet can be used for joint material. We evaluated the effect of isothermal aging at 250 °C on shear strength of joints using an Au nanoporous sheet. The shear strength of the joint after isothermal storage at 250 °C for 1000h was more than 25 MPa.

Original languageEnglish
Title of host publicationIMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016
PublisherIMAPS-International Microelectronics and Packaging Society
Publication statusPublished - 2016
EventIMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016 - Albuquerque, United States
Duration: 2016 May 102016 May 12

Other

OtherIMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016
CountryUnited States
CityAlbuquerque
Period16/5/1016/5/12

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Nishikawa, H., Matsunaga, K., Kim, M. S., Saito, M., & Mizuno, J. (2016). Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach. In IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016 IMAPS-International Microelectronics and Packaging Society.