Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

H. Nishikawa, K. Matsunaga, M. S. Kim, Mikiko Saito, Jun Mizuno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

High-Temperature joining is a key technology for electronic component assembly and other high-Temperature applications. Recently, focusing on the sintering behavior of metal particles, the joining process using a nanoparticle paste has been proposed as an alternative to establish a high-Temperature joining technology. In this study, a feasibility study has been conducted to determine whether an Au nanoporous sheet can be used for joint material. We evaluated the effect of isothermal aging at 250 °C on shear strength of joints using an Au nanoporous sheet. The shear strength of the joint after isothermal storage at 250 °C for 1000h was more than 25 MPa.

Original languageEnglish
Title of host publicationIMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016
PublisherIMAPS-International Microelectronics and Packaging Society
Publication statusPublished - 2016
EventIMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016 - Albuquerque, United States
Duration: 2016 May 102016 May 12

Other

OtherIMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016
CountryUnited States
CityAlbuquerque
Period16/5/1016/5/12

Fingerprint

Joining
Shear strength
Aging of materials
High temperature applications
Sintering
Nanoparticles
Temperature
Metals

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Nishikawa, H., Matsunaga, K., Kim, M. S., Saito, M., & Mizuno, J. (2016). Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach. In IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016 IMAPS-International Microelectronics and Packaging Society.

Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach. / Nishikawa, H.; Matsunaga, K.; Kim, M. S.; Saito, Mikiko; Mizuno, Jun.

IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016. IMAPS-International Microelectronics and Packaging Society, 2016.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nishikawa, H, Matsunaga, K, Kim, MS, Saito, M & Mizuno, J 2016, Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach. in IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016. IMAPS-International Microelectronics and Packaging Society, IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016, Albuquerque, United States, 16/5/10.
Nishikawa H, Matsunaga K, Kim MS, Saito M, Mizuno J. Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach. In IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016. IMAPS-International Microelectronics and Packaging Society. 2016
Nishikawa, H. ; Matsunaga, K. ; Kim, M. S. ; Saito, Mikiko ; Mizuno, Jun. / Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach. IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016. IMAPS-International Microelectronics and Packaging Society, 2016.
@inproceedings{3ac1d1aa054041f6935889b5e1b20a61,
title = "Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach",
abstract = "High-Temperature joining is a key technology for electronic component assembly and other high-Temperature applications. Recently, focusing on the sintering behavior of metal particles, the joining process using a nanoparticle paste has been proposed as an alternative to establish a high-Temperature joining technology. In this study, a feasibility study has been conducted to determine whether an Au nanoporous sheet can be used for joint material. We evaluated the effect of isothermal aging at 250 °C on shear strength of joints using an Au nanoporous sheet. The shear strength of the joint after isothermal storage at 250 °C for 1000h was more than 25 MPa.",
author = "H. Nishikawa and K. Matsunaga and Kim, {M. S.} and Mikiko Saito and Jun Mizuno",
year = "2016",
language = "English",
booktitle = "IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016",
publisher = "IMAPS-International Microelectronics and Packaging Society",

}

TY - GEN

T1 - Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

AU - Nishikawa, H.

AU - Matsunaga, K.

AU - Kim, M. S.

AU - Saito, Mikiko

AU - Mizuno, Jun

PY - 2016

Y1 - 2016

N2 - High-Temperature joining is a key technology for electronic component assembly and other high-Temperature applications. Recently, focusing on the sintering behavior of metal particles, the joining process using a nanoparticle paste has been proposed as an alternative to establish a high-Temperature joining technology. In this study, a feasibility study has been conducted to determine whether an Au nanoporous sheet can be used for joint material. We evaluated the effect of isothermal aging at 250 °C on shear strength of joints using an Au nanoporous sheet. The shear strength of the joint after isothermal storage at 250 °C for 1000h was more than 25 MPa.

AB - High-Temperature joining is a key technology for electronic component assembly and other high-Temperature applications. Recently, focusing on the sintering behavior of metal particles, the joining process using a nanoparticle paste has been proposed as an alternative to establish a high-Temperature joining technology. In this study, a feasibility study has been conducted to determine whether an Au nanoporous sheet can be used for joint material. We evaluated the effect of isothermal aging at 250 °C on shear strength of joints using an Au nanoporous sheet. The shear strength of the joint after isothermal storage at 250 °C for 1000h was more than 25 MPa.

UR - http://www.scopus.com/inward/record.url?scp=84995642356&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84995642356&partnerID=8YFLogxK

M3 - Conference contribution

BT - IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016

PB - IMAPS-International Microelectronics and Packaging Society

ER -