High-Temperature joining is a key technology for electronic component assembly and other high-Temperature applications. Recently, focusing on the sintering behavior of metal particles, the joining process using a nanoparticle paste has been proposed as an alternative to establish a high-Temperature joining technology. In this study, a feasibility study has been conducted to determine whether an Au nanoporous sheet can be used for joint material. We evaluated the effect of isothermal aging at 250 °C on shear strength of joints using an Au nanoporous sheet. The shear strength of the joint after isothermal storage at 250 °C for 1000h was more than 25 MPa.
|Publication status||Published - 2016|
|Event||IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016 - Albuquerque, United States|
Duration: 2016 May 10 → 2016 May 12
|Conference||IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016|
|Period||16/5/10 → 16/5/12|
ASJC Scopus subject areas
- Electrical and Electronic Engineering