Effect of plasma surface-modification on the electrical conduction in high-density polyethylene

H. Hayashi, T. Nakano, K. Ishii, Yoshimichi Ohki

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    5 Citations (Scopus)

    Abstract

    The effects of surface-structural change of HDPE (high-density polyethylene) induced by exposure to plasmas of various gases on the conduction characteristics are studied. Fourier-transform-infrared spectra were obtained by the attenuated total reflection method, while electron-spin-resonance spectra were obtained at X-band. Conduction current (DC, 10 min value) and thermal-pulse current (TPC) were also measured. It is concluded that many transvinylenes and free radicals remain on the surface of high-density polyethylene treated by argon or hydrogen plasma, while in the case of oxygen plasma treatment, many carbonyls and only a few free radicals remain. The surface layer treated by hydrogen plasma or the successive exposure to oxygen or ozone impede electrons and holes from being injected into the polyethylene bulk beyond the surface layer.

    Original languageEnglish
    Title of host publicationConference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report
    PublisherPubl by IEEE
    Pages190-195
    Number of pages6
    Publication statusPublished - 1990 Oct
    Event1990 Conference on Electrical Insulation and Dielectric Phenomena - Pocono Manor, PA, USA
    Duration: 1990 Oct 281990 Oct 31

    Other

    Other1990 Conference on Electrical Insulation and Dielectric Phenomena
    CityPocono Manor, PA, USA
    Period90/10/2890/10/31

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    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Industrial and Manufacturing Engineering
    • Building and Construction

    Cite this

    Hayashi, H., Nakano, T., Ishii, K., & Ohki, Y. (1990). Effect of plasma surface-modification on the electrical conduction in high-density polyethylene. In Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report (pp. 190-195). Publ by IEEE.