Effect of Tl-codeposition on Au electrodeposition from non-cyanide bath

M. Saito*, K. Inoue, K. Shiokawa, T. Homma

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)


Effect of Tl on the electrodeposition behavior of Au was investigated by electrochemical analysis, total-reflection X-ray fluorescene analysis, XRD, glow discharge optical emission spectrometer (GD-OES) and hardness measurement. The deposition rate increased with an increase in the amount of Tl addition to the bath. Tl was co-deposited at the interface between the seed layer and the Au films, as well as in the films. In asdeposited condition, the Tl contained films exhibited higher hardness compared with the Tl-free films, while both of them showed almost the same hardness after annealing. It was suggested that the hardness is correlated with the crystal orientation of the grains.

Original languageEnglish
Title of host publicationFundamentals of Electrochemical Growth
Subtitle of host publicationFrom UPD to Microstructures - Symposium in Memory of Prof. Evgeni Budevski
PublisherElectrochemical Society Inc.
Number of pages10
ISBN (Electronic)9781566778084
ISBN (Print)9781566778084
Publication statusPublished - 2009

Publication series

NameECS Transactions
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

ASJC Scopus subject areas

  • Engineering(all)


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