Effect of Various Parameters on the Shear Strength of Solid-State Nanoporous Cu Bonding in Cu–Cu Disks for Power Device Packaging

Byungho Park*, Duy Le Han, Mikiko Saito, Jun Mizuno, Hiroshi Nishikawa

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

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Physics & Astronomy

Engineering & Materials Science

Chemical Compounds