Effects of additives on copper electrodeposition in submicrometer trenches

Madoka Hasegawa, Yoshinori Negishi, Takuya Nakanishi, Tetsuya Osaka

Research output: Contribution to journalArticle

83 Citations (Scopus)

Abstract

Effects of the conventional bath additives [chloride ions (Cl-), poly(ethylene glycol) (PEG), bis(3-sulfopropyl)disulfide (SPS), and Janus green B (JGB)] used in the damascene process on the filling of submicrometer trenches with electrodeposited copper were investigated by electrochemical polarization measurement and cross-sectional microscopy. The combination of Cl- and PEG inhibited copper deposition in the areas of opening of the trenches, while SPS accelerated it at the bottom. Polarization curves showed that the degree of acceleration of copper deposition by SPS increases with the concentration of SPS. This SPS concentration-dependent acceleration accounts for the observed bottom-up growth. The addition of JGB inhibited copper deposition at the later stages of the filling process, leading to the suppression of the overfill phenomenon, although the bottom-up growth was also inhibited at high JGB concentrations. Bath agitation significantly enhanced the inhibition effect of JGB on the overfill phenomenon, without disturbing the bottom-up growth.

Original languageEnglish
JournalJournal of the Electrochemical Society
Volume152
Issue number4
DOIs
Publication statusPublished - 2005

Fingerprint

disulfides
Janus
Electrodeposition
electrodeposition
Disulfides
Copper
copper
Polyethylene glycols
Polarization
glycols
baths
ethylene
agitation
polarization
Microscopic examination
Chlorides
chlorides
retarding
Ions
microscopy

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Effects of additives on copper electrodeposition in submicrometer trenches. / Hasegawa, Madoka; Negishi, Yoshinori; Nakanishi, Takuya; Osaka, Tetsuya.

In: Journal of the Electrochemical Society, Vol. 152, No. 4, 2005.

Research output: Contribution to journalArticle

Hasegawa, Madoka ; Negishi, Yoshinori ; Nakanishi, Takuya ; Osaka, Tetsuya. / Effects of additives on copper electrodeposition in submicrometer trenches. In: Journal of the Electrochemical Society. 2005 ; Vol. 152, No. 4.
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