Abstract
Effects of Al 2O 3 films in the system of Au/Al joint widely used in semi-conductor devices at present have been studied. In the experiment, a thin film of Au/Al 2O 3/Al was used, and the diffusion of Au atoms across through Al 2O 3 films and the formation of intermetallic compound at temperatures between 25°C and 500°C were observed by using Auger electron spectroscopy, X-ray photoelectron spectroscopy, electric resistance measurement and secondary ion mass spectrometer with using 18O as a tracer. It has been cleared from test results that, (1) Au diffuses through Al 2O 3 films and reacts to Al, (2) as temperature rises up, the intermetallic compound grows in an island formation for Au/Al 2O 3/Al system, and (3) the behavior of its growth varies with the presence of oxygen in the atmosphere applied. On the basis of the above results, the effects of Al 2O 3 films on the reliability of Au/Al joint are discussed in this paper.
| Original language | English |
|---|---|
| Pages (from-to) | 95-101 |
| Number of pages | 7 |
| Journal | Nippon Steel Technical Report |
| Issue number | 72 |
| Publication status | Published - 1997 Jan |
| Externally published | Yes |
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ASJC Scopus subject areas
- Metals and Alloys
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Effects of Al 2O 3 films on the reliability of Au/Al joint. / Tsuge, Atsuko; Uno, Tomohiro; Mizuno, Kaoru; Tatsumi, Kohei.
In: Nippon Steel Technical Report, No. 72, 01.1997, p. 95-101.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Effects of Al 2O 3 films on the reliability of Au/Al joint
AU - Tsuge, Atsuko
AU - Uno, Tomohiro
AU - Mizuno, Kaoru
AU - Tatsumi, Kohei
PY - 1997/1
Y1 - 1997/1
N2 - Effects of Al 2O 3 films in the system of Au/Al joint widely used in semi-conductor devices at present have been studied. In the experiment, a thin film of Au/Al 2O 3/Al was used, and the diffusion of Au atoms across through Al 2O 3 films and the formation of intermetallic compound at temperatures between 25°C and 500°C were observed by using Auger electron spectroscopy, X-ray photoelectron spectroscopy, electric resistance measurement and secondary ion mass spectrometer with using 18O as a tracer. It has been cleared from test results that, (1) Au diffuses through Al 2O 3 films and reacts to Al, (2) as temperature rises up, the intermetallic compound grows in an island formation for Au/Al 2O 3/Al system, and (3) the behavior of its growth varies with the presence of oxygen in the atmosphere applied. On the basis of the above results, the effects of Al 2O 3 films on the reliability of Au/Al joint are discussed in this paper.
AB - Effects of Al 2O 3 films in the system of Au/Al joint widely used in semi-conductor devices at present have been studied. In the experiment, a thin film of Au/Al 2O 3/Al was used, and the diffusion of Au atoms across through Al 2O 3 films and the formation of intermetallic compound at temperatures between 25°C and 500°C were observed by using Auger electron spectroscopy, X-ray photoelectron spectroscopy, electric resistance measurement and secondary ion mass spectrometer with using 18O as a tracer. It has been cleared from test results that, (1) Au diffuses through Al 2O 3 films and reacts to Al, (2) as temperature rises up, the intermetallic compound grows in an island formation for Au/Al 2O 3/Al system, and (3) the behavior of its growth varies with the presence of oxygen in the atmosphere applied. On the basis of the above results, the effects of Al 2O 3 films on the reliability of Au/Al joint are discussed in this paper.
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M3 - Article
AN - SCOPUS:3643097307
SP - 95
EP - 101
JO - Nippon Steel Technical Report
JF - Nippon Steel Technical Report
SN - 0300-306X
IS - 72
ER -