Effects of Al 2O 3 films on the reliability of Au/Al joint

Atsuko Tsuge; Tomohiro Uno; Kaoru Mizuno; Kohei Tatsumi

Effects of Al ₂O ₃ films on the reliability of Au/Al joint

Atsuko Tsuge, Tomohiro Uno, Kaoru Mizuno, Kohei Tatsumi

Research output: Contribution to journal › Article

Abstract

Effects of Al ₂O ₃ films in the system of Au/Al joint widely used in semi-conductor devices at present have been studied. In the experiment, a thin film of Au/Al ₂O ₃/Al was used, and the diffusion of Au atoms across through Al ₂O ₃ films and the formation of intermetallic compound at temperatures between 25°C and 500°C were observed by using Auger electron spectroscopy, X-ray photoelectron spectroscopy, electric resistance measurement and secondary ion mass spectrometer with using ¹⁸O as a tracer. It has been cleared from test results that, (1) Au diffuses through Al ₂O ₃ films and reacts to Al, (2) as temperature rises up, the intermetallic compound grows in an island formation for Au/Al ₂O ₃/Al system, and (3) the behavior of its growth varies with the presence of oxygen in the atmosphere applied. On the basis of the above results, the effects of Al ₂O ₃ films on the reliability of Au/Al joint are discussed in this paper.

Original language	English
Pages (from-to)	95-101
Number of pages	7
Journal	Nippon Steel Technical Report
Issue number	72
Publication status	Published - 1997 Jan 1
Externally published	Yes

ASJC Scopus subject areas

Mechanics of Materials
Metals and Alloys
Materials Chemistry

Access to Document

Fingerprint Dive into the research topics of 'Effects of Al <sub>2</sub>O <sub>3</sub> films on the reliability of Au/Al joint'. Together they form a unique fingerprint.

Cite this

Tsuge, A., Uno, T., Mizuno, K., & Tatsumi, K. (1997). Effects of Al ₂O ₃ films on the reliability of Au/Al joint. Nippon Steel Technical Report, (72), 95-101.

@article{974febb3f468461987c13b5668a53f03,

title = "Effects of Al 2O 3 films on the reliability of Au/Al joint",

abstract = "Effects of Al 2O 3 films in the system of Au/Al joint widely used in semi-conductor devices at present have been studied. In the experiment, a thin film of Au/Al 2O 3/Al was used, and the diffusion of Au atoms across through Al 2O 3 films and the formation of intermetallic compound at temperatures between 25°C and 500°C were observed by using Auger electron spectroscopy, X-ray photoelectron spectroscopy, electric resistance measurement and secondary ion mass spectrometer with using 18O as a tracer. It has been cleared from test results that, (1) Au diffuses through Al 2O 3 films and reacts to Al, (2) as temperature rises up, the intermetallic compound grows in an island formation for Au/Al 2O 3/Al system, and (3) the behavior of its growth varies with the presence of oxygen in the atmosphere applied. On the basis of the above results, the effects of Al 2O 3 films on the reliability of Au/Al joint are discussed in this paper.",

author = "Atsuko Tsuge and Tomohiro Uno and Kaoru Mizuno and Kohei Tatsumi",

year = "1997",

month = jan,

day = "1",

language = "English",

pages = "95--101",

journal = "Nippon Steel Technical Report",

issn = "0300-306X",

publisher = "Nippon Steel Corporation",

number = "72",

}

TY - JOUR

T1 - Effects of Al 2O 3 films on the reliability of Au/Al joint

AU - Tsuge, Atsuko

AU - Uno, Tomohiro

AU - Mizuno, Kaoru

AU - Tatsumi, Kohei

PY - 1997/1/1

Y1 - 1997/1/1

N2 - Effects of Al 2O 3 films in the system of Au/Al joint widely used in semi-conductor devices at present have been studied. In the experiment, a thin film of Au/Al 2O 3/Al was used, and the diffusion of Au atoms across through Al 2O 3 films and the formation of intermetallic compound at temperatures between 25°C and 500°C were observed by using Auger electron spectroscopy, X-ray photoelectron spectroscopy, electric resistance measurement and secondary ion mass spectrometer with using 18O as a tracer. It has been cleared from test results that, (1) Au diffuses through Al 2O 3 films and reacts to Al, (2) as temperature rises up, the intermetallic compound grows in an island formation for Au/Al 2O 3/Al system, and (3) the behavior of its growth varies with the presence of oxygen in the atmosphere applied. On the basis of the above results, the effects of Al 2O 3 films on the reliability of Au/Al joint are discussed in this paper.

AB - Effects of Al 2O 3 films in the system of Au/Al joint widely used in semi-conductor devices at present have been studied. In the experiment, a thin film of Au/Al 2O 3/Al was used, and the diffusion of Au atoms across through Al 2O 3 films and the formation of intermetallic compound at temperatures between 25°C and 500°C were observed by using Auger electron spectroscopy, X-ray photoelectron spectroscopy, electric resistance measurement and secondary ion mass spectrometer with using 18O as a tracer. It has been cleared from test results that, (1) Au diffuses through Al 2O 3 films and reacts to Al, (2) as temperature rises up, the intermetallic compound grows in an island formation for Au/Al 2O 3/Al system, and (3) the behavior of its growth varies with the presence of oxygen in the atmosphere applied. On the basis of the above results, the effects of Al 2O 3 films on the reliability of Au/Al joint are discussed in this paper.

UR - http://www.scopus.com/inward/record.url?scp=3643097307&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=3643097307&partnerID=8YFLogxK

M3 - Article

AN - SCOPUS:3643097307

SP - 95

EP - 101

JO - Nippon Steel Technical Report

JF - Nippon Steel Technical Report

SN - 0300-306X

IS - 72

ER -