Effects of curing and filler dispersion methods on dielectric properties of epoxy nanocomposites

N. Tagami, M. Okada, Naoshi Hirai, T. Tanaka, Yoshimichi Ohki, T. Imai, M. Harada, M. Ochi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

Effects of the differences in the curing agent and filler dispersion method on the dielectric properties were examined for epoxy/clay nanocomposites. Measurements of permittivity, conductivity, and space charge distribution suggest that the curing agent gives a strong effect and the presence of nanofillers affects secondly, while the filler dispersion method gives a weak effect.

Original languageEnglish
Title of host publicationAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
Pages232-235
Number of pages4
DOIs
Publication statusPublished - 2007
Event2007 Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP - Vancouver, BC, Canada
Duration: 2007 Oct 142007 Oct 19

Other

Other2007 Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
CountryCanada
CityVancouver, BC
Period07/10/1407/10/19

Fingerprint

Dielectric properties
Curing
Fillers
Nanocomposites
Charge distribution
Electric space charge
Clay
Permittivity
clay

ASJC Scopus subject areas

  • Engineering(all)
  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Tagami, N., Okada, M., Hirai, N., Tanaka, T., Ohki, Y., Imai, T., ... Ochi, M. (2007). Effects of curing and filler dispersion methods on dielectric properties of epoxy nanocomposites. In Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP (pp. 232-235). [4451465] https://doi.org/10.1109/CEIDP.2007.4451465

Effects of curing and filler dispersion methods on dielectric properties of epoxy nanocomposites. / Tagami, N.; Okada, M.; Hirai, Naoshi; Tanaka, T.; Ohki, Yoshimichi; Imai, T.; Harada, M.; Ochi, M.

Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2007. p. 232-235 4451465.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Tagami, N, Okada, M, Hirai, N, Tanaka, T, Ohki, Y, Imai, T, Harada, M & Ochi, M 2007, Effects of curing and filler dispersion methods on dielectric properties of epoxy nanocomposites. in Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP., 4451465, pp. 232-235, 2007 Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP, Vancouver, BC, Canada, 07/10/14. https://doi.org/10.1109/CEIDP.2007.4451465
Tagami N, Okada M, Hirai N, Tanaka T, Ohki Y, Imai T et al. Effects of curing and filler dispersion methods on dielectric properties of epoxy nanocomposites. In Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2007. p. 232-235. 4451465 https://doi.org/10.1109/CEIDP.2007.4451465
Tagami, N. ; Okada, M. ; Hirai, Naoshi ; Tanaka, T. ; Ohki, Yoshimichi ; Imai, T. ; Harada, M. ; Ochi, M. / Effects of curing and filler dispersion methods on dielectric properties of epoxy nanocomposites. Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2007. pp. 232-235
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