Effects of curing and filler dispersion methods on dielectric properties of epoxy nanocomposites

N. Tagami, M. Okada, N. Hirai, T. Tanaka, Y. Ohki, T. Imai, M. Harada, M. Ochi

Research output: Contribution to journalConference article

7 Citations (Scopus)

Abstract

Effects of the differences in the curing agent and filler dispersion method on the dielectric properties were examined for epoxy/clay nanocomposites. Measurements of permittivity, conductivity, and space charge distribution suggest that the curing agent gives a strong effect and the presence of nanofillers affects secondly, while the filler dispersion method gives a weak effect.

Original languageEnglish
Article number4451465
Pages (from-to)232-235
Number of pages4
JournalAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
DOIs
Publication statusPublished - 2007 Dec 1
Event2007 Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP - Vancouver, BC, Canada
Duration: 2007 Oct 142007 Oct 19

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ASJC Scopus subject areas

  • Engineering(all)
  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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