Effects of curing and filler dispersion methods on dielectric properties of epoxy nanocomposites

N. Tagami*, M. Okada, N. Hirai, T. Tanaka, Y. Ohki, T. Imai, M. Harada, M. Ochi

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

7 Citations (Scopus)

Abstract

Effects of the differences in the curing agent and filler dispersion method on the dielectric properties were examined for epoxy/clay nanocomposites. Measurements of permittivity, conductivity, and space charge distribution suggest that the curing agent gives a strong effect and the presence of nanofillers affects secondly, while the filler dispersion method gives a weak effect.

Original languageEnglish
Article number4451465
Pages (from-to)232-235
Number of pages4
JournalAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
DOIs
Publication statusPublished - 2007
Event2007 Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP - Vancouver, BC, Canada
Duration: 2007 Oct 142007 Oct 19

ASJC Scopus subject areas

  • Engineering(all)
  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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