Effects of edge and corner bond adhesives on the drop reliability of package-on-package bottom package assemblies

Hongbin Shi, Toshitsugu Ueda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    10 Citations (Scopus)

    Abstract

    This paper presents the drop test results for edge and corner bonded 0.5 mm pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package (PoP) bottom packages on a standard JEDEC drop test board. The test boards were dropped through an 1828.8 mm long, 110.0 mm diameter tube onto a steel plate. The daisy chain resistance of each PSvfBGA was measured by a post-drop resistance measurement system after each drop and a static 10 Ω rise (or more) from initial resistance was considered as the failure criterion. Three materials used in this study were a UV-cured acrylic edge bond adhesive, a thermal-cured epoxy edge bond adhesive and a thermal-cured epoxy corner bond adhesive. Tests were conducted on PSvfBGAs with adhesives and PSvfBGAs without bonding. Statistics of the number of drops-to-failure for the fifteen component locations on each test board are reported. The test results show that the drop test performance of PSvfBGAs with UV-cured edge bonding, thermal-cured edge bonding and corner bonding are respectively about six, eight and seven times better than the PSvfBGAs without bonding. Failure analysis was performed using dye-and-pry, cross section scanning electron microscope (SEM) and energy dispersive X-ray (EDX) methods. The most common failure mode observed is solder cracking at component side intermetallic compound (IMC)/solder interface.

    Original languageEnglish
    Title of host publicationICCRD2011 - 2011 3rd International Conference on Computer Research and Development
    Pages416-420
    Number of pages5
    Volume3
    DOIs
    Publication statusPublished - 2011
    Event2011 3rd International Conference on Computer Research and Development, ICCRD 2011 - Shanghai
    Duration: 2011 Mar 112011 Mar 15

    Other

    Other2011 3rd International Conference on Computer Research and Development, ICCRD 2011
    CityShanghai
    Period11/3/1111/3/15

    Keywords

    • adhesives
    • corner bond
    • drop reliability
    • edge bond
    • package stackable very thin fine pitch ball grid array (PSvfBGA)

    ASJC Scopus subject areas

    • Computer Science Applications

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  • Cite this

    Shi, H., & Ueda, T. (2011). Effects of edge and corner bond adhesives on the drop reliability of package-on-package bottom package assemblies. In ICCRD2011 - 2011 3rd International Conference on Computer Research and Development (Vol. 3, pp. 416-420). [5764227] https://doi.org/10.1109/ICCRD.2011.5764227