Effects of humidity and temperature on space charge distribution profiles in printed circuit board insulations

Yasutsune Echigo, Hidesato Tanaka, Yoshimichi Ohki, Kaori Fukunaga, Takashi Maeno, Kenji Okamoto

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

The properties of bulk insulation in printed circuit boards (PCBs) have become even more important, especially for those with a multilayered or embedded structure. In particular, the spatial distribution of internal charge carriers, mainly due to ionic impurities, is thought to affect the reliability of bulk insulation. Therefore, the effects of humidity and temperature on space charge distribution profiles in a five-layered composite of aramid paper and epoxy resin are studied in this paper. More charge carriers are induced at higher temperatures with humidity. A relative humidity of 55% is high enough to induce a saturated amount of charge carriers in the present samples at 40°C.

Original languageEnglish
Title of host publication2007 International Conference on Solid Dielectrics, ICSD
Pages458-461
Number of pages4
DOIs
Publication statusPublished - 2007 Dec 1
Event2007 International Conference on Solid Dielectrics, ICSD - Winchester, United Kingdom
Duration: 2007 Jul 82007 Jul 13

Publication series

Name2007 International Conference on Solid Dielectrics, ICSD

Conference

Conference2007 International Conference on Solid Dielectrics, ICSD
CountryUnited Kingdom
CityWinchester
Period07/7/807/7/13

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Effects of humidity and temperature on space charge distribution profiles in printed circuit board insulations'. Together they form a unique fingerprint.

  • Cite this

    Echigo, Y., Tanaka, H., Ohki, Y., Fukunaga, K., Maeno, T., & Okamoto, K. (2007). Effects of humidity and temperature on space charge distribution profiles in printed circuit board insulations. In 2007 International Conference on Solid Dielectrics, ICSD (pp. 458-461). [4290850] (2007 International Conference on Solid Dielectrics, ICSD). https://doi.org/10.1109/ICSD.2007.4290850