Effects of impurities on resistivity of electrodeposited high-B s CoNiFe-based soft magnetic thin films

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

Controlling the very small amount of inclusion of impurity elements by addition to the plating bath of various organic additives was found to be very effective in developing electrodeposited high-B s CoNiFe soft magnetic thin films with desirably high resistivity. Included impurities were suggested to cause not only electron scattering but also decreasing grain size, both of which led to an increase of the resistivity. Chemical state of impurities was indicated to be controllable by selection of additives based on the functional group for adsorption.

Original languageEnglish
Pages (from-to)1761-1763
Number of pages3
JournalIEEE Transactions on Magnetics
Volume37
Issue number4 I
DOIs
Publication statusPublished - 2001 Jul

Fingerprint

Magnetic thin films
Impurities
impurities
electrical resistivity
thin films
Electron scattering
plating
Plating
Functional groups
baths
electron scattering
grain size
inclusions
Adsorption
adsorption
causes

Keywords

  • Electrodeposition
  • Impurities
  • Organic additives
  • Resistivity
  • Soft magnetic thin films

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Physics and Astronomy (miscellaneous)

Cite this

Effects of impurities on resistivity of electrodeposited high-B s CoNiFe-based soft magnetic thin films. / Osaka, Tetsuya; Yokoshima, Tokihiko; Nakanishi, Takuya.

In: IEEE Transactions on Magnetics, Vol. 37, No. 4 I, 07.2001, p. 1761-1763.

Research output: Contribution to journalArticle

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