Effects of impurities on resistivity of electrodeposited high-B s CoNiFe-based soft magnetic thin films

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Abstract

Controlling the very small amount of inclusion of impurity elements by addition to the plating bath of various organic additives was found to be very effective in developing electrodeposited high-B s CoNiFe soft magnetic thin films with desirably high resistivity. Included impurities were suggested to cause not only electron scattering but also decreasing grain size, both of which led to an increase of the resistivity. Chemical state of impurities was indicated to be controllable by selection of additives based on the functional group for adsorption.

Original languageEnglish
Pages (from-to)1761-1763
Number of pages3
JournalIEEE Transactions on Magnetics
Volume37
Issue number4 I
DOIs
Publication statusPublished - 2001 Jul 1
Event8th Joint Magnetism and Magnetic Materials -International Magnetic Conference- (MMM-Intermag) - San Antonio, TX, United States
Duration: 2001 Jan 72001 Jan 11

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Keywords

  • Electrodeposition
  • Impurities
  • Organic additives
  • Resistivity
  • Soft magnetic thin films

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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