Effects of mica fillers on dielectric properties of polyamide nanocomposites

N. Fuse, M. Kozako, T. Tanaka, Y. Ohki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

17 Citations (Scopus)

Abstract

Complex permittivity, dielectric strength, and electrical conductivity of polyamide-6/mica nanocomposites were measured. By analyzing the permittivity spectra, it was found that the distribution of relaxation times becomes smaller with the addition of nanofillers. This indicates restriction of molecular motion and strong ionic bonds at the resin/mica interfaces. The conduction current was found to decrease with the addition of nanofillers. The barrier effect, formation of nanometric spherulites, and carrier trapping are considered to be responsible, in addition to the above-mentioned two effects at the interfaces. The breakdown strength is independent of the nanofiller content.

Original languageEnglish
Title of host publication2005 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP '05
Pages148-151
Number of pages4
DOIs
Publication statusPublished - 2005 Dec 1
Event2005 Conference on Electrical Insulation and Dielectric Phenomena, CEIDP '05 - Nashville, TN, United States
Duration: 2005 Oct 162005 Oct 19

Publication series

NameAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
Volume2005
ISSN (Print)0084-9162

Conference

Conference2005 Conference on Electrical Insulation and Dielectric Phenomena, CEIDP '05
CountryUnited States
CityNashville, TN
Period05/10/1605/10/19

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Effects of mica fillers on dielectric properties of polyamide nanocomposites'. Together they form a unique fingerprint.

  • Cite this

    Fuse, N., Kozako, M., Tanaka, T., & Ohki, Y. (2005). Effects of mica fillers on dielectric properties of polyamide nanocomposites. In 2005 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP '05 (pp. 148-151). [1560642] (Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP; Vol. 2005). https://doi.org/10.1109/CEIDP.2005.1560642