Efficient dummy filling methods to reduce interconnect capacitance and number of dummy metal fills

Atsushi Kurokawa, Toshiki Kanamoto, Tetsuya Ibe, Akira Kasebe, Wei Fong Chang, Tetsuro Kage, Yasuaki Inoue, Hiroo Masuda

    Research output: Contribution to journalArticlepeer-review

    3 Citations (Scopus)

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    Mathematics

    Engineering & Materials Science