Electrochemical characterization of nitrogen-incorporated tetrahedral carbon films grown by a filtered cathodic vacuum arc

Nelson C. Yee, Qingfang Shi, Wen Bin Cai, Daniel Alberto Scherson, Barry Miller*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

24 Citations (Scopus)

Abstract

Tetrahedral carbon films incorporating nitrogen (taC:N) have been produced on Si, Ta, Ti, and electrochemically roughened Ag surfaces using a single commercial filtered cathodic vacuum arc (FCVA) carbon ion source in the presence of nitrogen gas at reduced pressure. Highly resolved Raman spectra under visible laser excitation were obtained for taC:N films only a few nanometers thick deposited on roughened Ag, including the rather elusive T band characteristic of sp3 hybridized bonding. The electrochemical response of taC:N supported on polished Ta in aqueous solutions was virtually identical to that reported earlier for taC:N films on Si prepared by the simultaneous incidence of a custom-made FCVA carbon ion source and a nitrogen ion gun. Reversible kinetics for Ru(NH3)6Cl3 reduction in 1 M KCl and electrocatalytic activity for chlorine evolution and reduction in 1 M HCl solutions are observed juxtaposed to high overpotentials for hydrogen and oxygen evolution.

Original languageEnglish
JournalElectrochemical and Solid-State Letters
Volume4
Issue number10
DOIs
Publication statusPublished - 2001 Oct 1
Externally publishedYes

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Materials Science(all)
  • Physical and Theoretical Chemistry
  • Electrochemistry
  • Electrical and Electronic Engineering

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