@inbook{de98801e6e334fa9b0f9bb64a9a7b976,
title = "Electrochemical Deposition Process for ULSI Interconnection Devices",
keywords = "Copper deposition, interconnection by electrochemical techniques - copper trench filling by electrodeposition, Electrochemical deposition process for ULSI interconnection devices, Electroless process for ULSI interconnect fabrication process - fabricating diffusion barrier layers, by electrochemical deposition technique",
author = "Tetsuya Osaka and Masahiro Yoshino",
year = "2011",
month = feb,
day = "24",
doi = "10.1002/9780470602638.ch13",
language = "English",
isbn = "9780470167786",
pages = "369--382",
booktitle = "Modern Electroplating",
publisher = "John Wiley and Sons",
}