Electrochemical Deposition Process for ULSI Interconnection Devices

Tetsuya Osaka, Masahiro Yoshino

Research output: Chapter in Book/Report/Conference proceedingChapter

3 Citations (Scopus)
Original languageEnglish
Title of host publicationModern Electroplating
Subtitle of host publicationFifth Edition
PublisherJohn Wiley and Sons
Pages369-382
Number of pages14
ISBN (Print)9780470167786
DOIs
Publication statusPublished - 2011 Feb 24

Keywords

  • Copper deposition, interconnection by electrochemical techniques - copper trench filling by electrodeposition
  • Electrochemical deposition process for ULSI interconnection devices
  • Electroless process for ULSI interconnect fabrication process - fabricating diffusion barrier layers, by electrochemical deposition technique

ASJC Scopus subject areas

  • Chemistry(all)

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