Electrochemical Deposition Process for ULSI Interconnection Devices

Tetsuya Osaka, Masahiro Yoshino

Research output: Chapter in Book/Report/Conference proceedingChapter

3 Citations (Scopus)
Original languageEnglish
Title of host publicationModern Electroplating: Fifth Edition
PublisherJohn Wiley and Sons
Pages369-382
Number of pages14
ISBN (Print)9780470167786
DOIs
Publication statusPublished - 2011 Feb 24

Keywords

  • Copper deposition, interconnection by electrochemical techniques - copper trench filling by electrodeposition
  • Electrochemical deposition process for ULSI interconnection devices
  • Electroless process for ULSI interconnect fabrication process - fabricating diffusion barrier layers, by electrochemical deposition technique

ASJC Scopus subject areas

  • Chemistry(all)

Cite this

Osaka, T., & Yoshino, M. (2011). Electrochemical Deposition Process for ULSI Interconnection Devices. In Modern Electroplating: Fifth Edition (pp. 369-382). John Wiley and Sons. https://doi.org/10.1002/9780470602638.ch13

Electrochemical Deposition Process for ULSI Interconnection Devices. / Osaka, Tetsuya; Yoshino, Masahiro.

Modern Electroplating: Fifth Edition. John Wiley and Sons, 2011. p. 369-382.

Research output: Chapter in Book/Report/Conference proceedingChapter

Osaka, T & Yoshino, M 2011, Electrochemical Deposition Process for ULSI Interconnection Devices. in Modern Electroplating: Fifth Edition. John Wiley and Sons, pp. 369-382. https://doi.org/10.1002/9780470602638.ch13
Osaka T, Yoshino M. Electrochemical Deposition Process for ULSI Interconnection Devices. In Modern Electroplating: Fifth Edition. John Wiley and Sons. 2011. p. 369-382 https://doi.org/10.1002/9780470602638.ch13
Osaka, Tetsuya ; Yoshino, Masahiro. / Electrochemical Deposition Process for ULSI Interconnection Devices. Modern Electroplating: Fifth Edition. John Wiley and Sons, 2011. pp. 369-382
@inbook{de98801e6e334fa9b0f9bb64a9a7b976,
title = "Electrochemical Deposition Process for ULSI Interconnection Devices",
keywords = "Copper deposition, interconnection by electrochemical techniques - copper trench filling by electrodeposition, Electrochemical deposition process for ULSI interconnection devices, Electroless process for ULSI interconnect fabrication process - fabricating diffusion barrier layers, by electrochemical deposition technique",
author = "Tetsuya Osaka and Masahiro Yoshino",
year = "2011",
month = "2",
day = "24",
doi = "10.1002/9780470602638.ch13",
language = "English",
isbn = "9780470167786",
pages = "369--382",
booktitle = "Modern Electroplating: Fifth Edition",
publisher = "John Wiley and Sons",

}

TY - CHAP

T1 - Electrochemical Deposition Process for ULSI Interconnection Devices

AU - Osaka, Tetsuya

AU - Yoshino, Masahiro

PY - 2011/2/24

Y1 - 2011/2/24

KW - Copper deposition, interconnection by electrochemical techniques - copper trench filling by electrodeposition

KW - Electrochemical deposition process for ULSI interconnection devices

KW - Electroless process for ULSI interconnect fabrication process - fabricating diffusion barrier layers, by electrochemical deposition technique

UR - http://www.scopus.com/inward/record.url?scp=84885701750&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84885701750&partnerID=8YFLogxK

U2 - 10.1002/9780470602638.ch13

DO - 10.1002/9780470602638.ch13

M3 - Chapter

AN - SCOPUS:84885701750

SN - 9780470167786

SP - 369

EP - 382

BT - Modern Electroplating: Fifth Edition

PB - John Wiley and Sons

ER -