Electrochemical formation process of Si macropore and metal filling for high aspect ratio metal microstructure using single electrolyte system

Hirotaka Sato, Takayuki Homma, Kentaro Mori, Tetsuya Osaka, Shuichi Shoji

Research output: Contribution to journalArticle

19 Citations (Scopus)

Abstract

Array of macropores filled with electrodeposited Ni was formed on Si substrate applying the novel process, which consists of Si electrochemical etching and Ni electrodeposition using single electrolyte. This electrolyte contained HF as Si dissolution agent and Ni(OSO2NH2) 2 4H2O as Ni2+ source for Ni electrodeposition. First, array of macropores was formed on Si (100) substrate by applying anodic current. The formation was carried out area-selectively by applying Au/Cr micropatterns formed at the back side surface of the substrate as the shade mask, which enables to control the illumination condition for hole generation condition. Subsequently, the applied bias was switched to cathodic current, and Ni was filled into c.a. 200 μm depth Si macropores without void-like defects. Array of Ni needles with smooth surface was formed area-selectively by removal of the Si region of the Ni filled specimen with 25 wt% tetramethylammonium hydroxide (TMAH) aqueous solution at 90°C.

Original languageEnglish
Pages (from-to)275-278
Number of pages4
JournalElectrochemistry
Volume73
Issue number4
Publication statusPublished - 2005 Apr

Fingerprint

Electrolytes
Aspect ratio
Metals
Electrodeposition
Microstructure
Substrates
Electrochemical etching
Needles
Masks
Dissolution
Lighting
Defects
tetramethylammonium

Keywords

  • Electrochemical Nanofabrication
  • Electrodeposition
  • Microneedle Array
  • Silicon Anodization
  • Single-batch Process

ASJC Scopus subject areas

  • Electrochemistry

Cite this

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title = "Electrochemical formation process of Si macropore and metal filling for high aspect ratio metal microstructure using single electrolyte system",
abstract = "Array of macropores filled with electrodeposited Ni was formed on Si substrate applying the novel process, which consists of Si electrochemical etching and Ni electrodeposition using single electrolyte. This electrolyte contained HF as Si dissolution agent and Ni(OSO2NH2) 2 4H2O as Ni2+ source for Ni electrodeposition. First, array of macropores was formed on Si (100) substrate by applying anodic current. The formation was carried out area-selectively by applying Au/Cr micropatterns formed at the back side surface of the substrate as the shade mask, which enables to control the illumination condition for hole generation condition. Subsequently, the applied bias was switched to cathodic current, and Ni was filled into c.a. 200 μm depth Si macropores without void-like defects. Array of Ni needles with smooth surface was formed area-selectively by removal of the Si region of the Ni filled specimen with 25 wt{\%} tetramethylammonium hydroxide (TMAH) aqueous solution at 90°C.",
keywords = "Electrochemical Nanofabrication, Electrodeposition, Microneedle Array, Silicon Anodization, Single-batch Process",
author = "Hirotaka Sato and Takayuki Homma and Kentaro Mori and Tetsuya Osaka and Shuichi Shoji",
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T1 - Electrochemical formation process of Si macropore and metal filling for high aspect ratio metal microstructure using single electrolyte system

AU - Sato, Hirotaka

AU - Homma, Takayuki

AU - Mori, Kentaro

AU - Osaka, Tetsuya

AU - Shoji, Shuichi

PY - 2005/4

Y1 - 2005/4

N2 - Array of macropores filled with electrodeposited Ni was formed on Si substrate applying the novel process, which consists of Si electrochemical etching and Ni electrodeposition using single electrolyte. This electrolyte contained HF as Si dissolution agent and Ni(OSO2NH2) 2 4H2O as Ni2+ source for Ni electrodeposition. First, array of macropores was formed on Si (100) substrate by applying anodic current. The formation was carried out area-selectively by applying Au/Cr micropatterns formed at the back side surface of the substrate as the shade mask, which enables to control the illumination condition for hole generation condition. Subsequently, the applied bias was switched to cathodic current, and Ni was filled into c.a. 200 μm depth Si macropores without void-like defects. Array of Ni needles with smooth surface was formed area-selectively by removal of the Si region of the Ni filled specimen with 25 wt% tetramethylammonium hydroxide (TMAH) aqueous solution at 90°C.

AB - Array of macropores filled with electrodeposited Ni was formed on Si substrate applying the novel process, which consists of Si electrochemical etching and Ni electrodeposition using single electrolyte. This electrolyte contained HF as Si dissolution agent and Ni(OSO2NH2) 2 4H2O as Ni2+ source for Ni electrodeposition. First, array of macropores was formed on Si (100) substrate by applying anodic current. The formation was carried out area-selectively by applying Au/Cr micropatterns formed at the back side surface of the substrate as the shade mask, which enables to control the illumination condition for hole generation condition. Subsequently, the applied bias was switched to cathodic current, and Ni was filled into c.a. 200 μm depth Si macropores without void-like defects. Array of Ni needles with smooth surface was formed area-selectively by removal of the Si region of the Ni filled specimen with 25 wt% tetramethylammonium hydroxide (TMAH) aqueous solution at 90°C.

KW - Electrochemical Nanofabrication

KW - Electrodeposition

KW - Microneedle Array

KW - Silicon Anodization

KW - Single-batch Process

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