Electrodeposition of amorphous Au-Ni alloy film

Noriyuki Yamachika, Yuta Musha, Junji Sasano, Kazutaka Senda, Masaru Kato, Yutaka Okinaka, Tetsuya Osaka

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Abstract

It was found that, by choosing an optimum bath composition, amorphous Au-Ni alloy containing up to 40 at.% of Au with respect to the sum of Au and Ni can be electrodeposited from a bath prepared by excluding tungsten from the Au-Ni-W bath that we developed previously. Elemental analysis showed that the deposit contains 15-20 at.% of carbon and 2 at.% of nitrogen. Hardness of this deposit is almost three times as high as that of the conventional hard gold. The electrical contact resistance measured against a pure gold wire is comparable to that of the hard gold. The amorphous structure of the Au-Ni deposit is stable at temperatures up to 300 °C for at least 1 h. The amorphous tungsten-free Au-Ni deposit is worthy of consideration for applications in the fabrication of micro- and nano-scale electrical contacts.

Original languageEnglish
Pages (from-to)4520-4527
Number of pages8
JournalElectrochimica Acta
Volume53
Issue number13
DOIs
Publication statusPublished - 2008 May 20

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Keywords

  • Alloy
  • Amorphous
  • Electroplating
  • Gold-Nickel
  • Tungsten-free

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Electrochemistry

Cite this

Yamachika, N., Musha, Y., Sasano, J., Senda, K., Kato, M., Okinaka, Y., & Osaka, T. (2008). Electrodeposition of amorphous Au-Ni alloy film. Electrochimica Acta, 53(13), 4520-4527. https://doi.org/10.1016/j.electacta.2008.01.018