Electrodeposition of amorphous Au-Ni alloy film

Noriyuki Yamachika, Yuta Musha, Junji Sasano, Kazutaka Senda, Masaru Kato, Yutaka Okinaka, Tetsuya Osaka

Research output: Contribution to journalArticle

16 Citations (Scopus)

Abstract

It was found that, by choosing an optimum bath composition, amorphous Au-Ni alloy containing up to 40 at.% of Au with respect to the sum of Au and Ni can be electrodeposited from a bath prepared by excluding tungsten from the Au-Ni-W bath that we developed previously. Elemental analysis showed that the deposit contains 15-20 at.% of carbon and 2 at.% of nitrogen. Hardness of this deposit is almost three times as high as that of the conventional hard gold. The electrical contact resistance measured against a pure gold wire is comparable to that of the hard gold. The amorphous structure of the Au-Ni deposit is stable at temperatures up to 300 °C for at least 1 h. The amorphous tungsten-free Au-Ni deposit is worthy of consideration for applications in the fabrication of micro- and nano-scale electrical contacts.

Original languageEnglish
Pages (from-to)4520-4527
Number of pages8
JournalElectrochimica Acta
Volume53
Issue number13
DOIs
Publication statusPublished - 2008 May 20

Fingerprint

Electrodeposition
Deposits
Gold
Tungsten
Contact resistance
Chemical analysis
Nitrogen
Carbon
Hardness
Wire
Fabrication
Temperature

Keywords

  • Alloy
  • Amorphous
  • Electroplating
  • Gold-Nickel
  • Tungsten-free

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Analytical Chemistry
  • Electrochemistry

Cite this

Yamachika, N., Musha, Y., Sasano, J., Senda, K., Kato, M., Okinaka, Y., & Osaka, T. (2008). Electrodeposition of amorphous Au-Ni alloy film. Electrochimica Acta, 53(13), 4520-4527. https://doi.org/10.1016/j.electacta.2008.01.018

Electrodeposition of amorphous Au-Ni alloy film. / Yamachika, Noriyuki; Musha, Yuta; Sasano, Junji; Senda, Kazutaka; Kato, Masaru; Okinaka, Yutaka; Osaka, Tetsuya.

In: Electrochimica Acta, Vol. 53, No. 13, 20.05.2008, p. 4520-4527.

Research output: Contribution to journalArticle

Yamachika, N, Musha, Y, Sasano, J, Senda, K, Kato, M, Okinaka, Y & Osaka, T 2008, 'Electrodeposition of amorphous Au-Ni alloy film', Electrochimica Acta, vol. 53, no. 13, pp. 4520-4527. https://doi.org/10.1016/j.electacta.2008.01.018
Yamachika N, Musha Y, Sasano J, Senda K, Kato M, Okinaka Y et al. Electrodeposition of amorphous Au-Ni alloy film. Electrochimica Acta. 2008 May 20;53(13):4520-4527. https://doi.org/10.1016/j.electacta.2008.01.018
Yamachika, Noriyuki ; Musha, Yuta ; Sasano, Junji ; Senda, Kazutaka ; Kato, Masaru ; Okinaka, Yutaka ; Osaka, Tetsuya. / Electrodeposition of amorphous Au-Ni alloy film. In: Electrochimica Acta. 2008 ; Vol. 53, No. 13. pp. 4520-4527.
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