Electroless nickel ternary alloy deposition on SiO2 for application to diffusion barrier layer in copper interconnect technology

Tetsuya Osaka*, Nao Takano, Tetsuya Kurokawa, Tomomi Kaneko, Kazuyoshi Ueno

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

56 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds